Allicdata Part #: | 677-10ABPE-ND |
Manufacturer Part#: |
677-10ABPE |
Price: | $ 1.04 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | HEATSINK |
More Detail: | Heat Sink TO-218, TO-220, TO-247, Multiwatt Alumin... |
DataSheet: | 677-10ABPE Datasheet/PDF |
Quantity: | 1000 |
600 +: | $ 0.94108 |
Series: | 677 |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | TO-218, TO-220, TO-247, Multiwatt |
Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular, Fins |
Length: | 1.000" (25.40mm) |
Width: | 1.650" (41.91mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.000" (25.40mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 3.10°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal management is the process of controlling and monitoring of components, liquid coolants, and the overall air temperature in an electronic system. The aim of thermal management is to reduce the amount of heat generated by a component or system to ensure that the system does not overheat and cause irreparable damage. Heat sinks are typically used as passive cooling systems to dissipate heat from an electronic device. The 677-10ABPE is one such heat sink and is increasingly being used in a range of applications.
The 677-10ABPE thermal sink is a medium power heat exchanger that can dissipate between 100 and 200 Watts of power. The device is able to effectively cool large memories, processors, FPGAs, PBCs, and other electronics components. The thermal management system consists of a heat sink that is attached directly to the element to be cooled and a cooling fan or system that blows air over the surface of the device. The heat sink is designed in such a way that it creates an air gap between the fins and the heat generating device, allowing air to pass through it more easily. This design also increases the contact area between the cooling fins and the surface of the heat sink, maximizing the efficiency of the heat transfer.
The active cooling system employed by the 677-10ABPE is a static reaction fan in combination with a heat exchanger. Cooling air enters the heat exchanger, where it passes over a series of cooling fins to absorb the heat from the device. The heated air is then expelled out of the system and the cooled air is circulated back into the device. The cooling fan is driven by a motor and is able to regulate the flow of air to the device to ensure that it is not subjected to excessive temperatures.
As well as being used in general electronics, the 677-10ABPE thermal sink is increasingly being used in more specialized applications. Its relatively low power rating makes it suitable for use in medical and laboratory equipment, such as incubators, x-ray machines, and MRI scanners. It is also used in military, aerospace, and automotive applications.
The 677-10ABPE thermal sink is a reliable and efficient cooling solution that can be used in a variety of applications. It is designed with a unique fin pattern that increases the area of contact between the cooling fins and the surface of the heat sink, enabling it to dissipate heat more quickly and efficiently. The device is also fitted with a cooling fan that can regulate the flow of air to the device, ensuring that it does not overheat and suffer irreparable damage.
The specific data is subject to PDF, and the above content is for reference