67997-208HLF Allicdata Electronics
Allicdata Part #:

609-3235-ND

Manufacturer Part#:

67997-208HLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN HEADER 8POS .100 STR 15AUConnector Header Thr...
More Detail: N/A
DataSheet: 67997-208HLF datasheet67997-208HLF Datasheet/PDF
Quantity: 4772
Stock 4772Can Ship Immediately
Specifications
Series: BERGSTIK® II
Packaging: Bulk 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 8
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Number of Positions Loaded: All
Style: Board to Board
Shrouding: Unshrouded
Mounting Type: Through Hole
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.230" (5.84mm)
Contact Length - Post: 0.120" (3.05mm)
Overall Contact Length: 0.450" (11.43mm)
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: --
Contact Material: Phosphor Bronze
Insulation Material: --
Features: --
Operating Temperature: --
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Description

Due to market price fluctuations,if you need to purchase or consult the price.You can contact us or emial to us:   sales@allicdata.com


1. Describe

BergStik® 2.54mm non-shielded connector can be used Surface Mount (SMT), Through Hole (THT), Press Fit, Stacking And pin paste (PIP) version. Single and double design Rows, they have straight or right angle options, from 2 to 72 positions. With "separate" design, each connector can be cut or Break it down into a length suitable for the application. Max The rated current of each contact is 3A. BergStik® 2.54mm extends the product range 0.25µm plated, non-shielded vertical joint, can be used for Standard size. It provides economical solutions for various applications application. It also specifies a maximum of 100 mating cycles. The BergStik® product line provides board-to-board, wire-to-board and wire-to-board interconnect solutions for all electronic equipment and devices.

2. Feature

    1. High-temperature thermoplastic materials

    2. Variable pitch height of stacked headings

    3. Allow double entry; mating from the top or bottom

    4. The blank 0.64mm square contact presents 4 surfaces of the same quality

    5. Bracket design

    6. Double-sided electroplating

    7. Tin-lead plating in the crimping area

    8. Keep legs option

    9. Press-in design, suitable for 1.02mm diameter holes, welded to plate products

  10. Comply with DIN 41651, HE13 and BT D2632

3. Benefit

    1. Reflow compatible

    2. Meet a wide range of applications

    3. Suitable for mezzanine applications, more flexible to meet different stack height requirements

    4. Can be used for winding

    5. Allow cleaning to remove welding contamination 

    6. Cost-effectiveness

    7. Easily insert pins into PCB

    8. High retention force on PCB

    9. Same layout on THT and press-in

  10. Qualified products



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