68418-136

Operating Temperature:	--
Insulation Height:	0.100" (2.54mm)
Contact Shape:	Square
Contact Finish - Mating:	Gold or Gold, GXT™
Contact Finish Thickness - Mating:	30.0µin (0.76µm)
Contact Finish - Post:	--
Contact Material:	Phosphor Bronze
Insulation Material:	--
Features:	--
Overall Contact Length:	0.730" (18.54mm)
Ingress Protection:	--
Material Flammability Rating:	UL94 V-0
Insulation Color:	Black
Current Rating:	--
Voltage Rating:	--
Mated Stacking Heights:	--
Contact Finish Thickness - Post:	--
Applications:	--
Number of Positions Loaded:	All
Packaging:	Bulk
Part Status:	Active
Connector Type:	Header
Contact Type:	Male Pin
Pitch - Mating:	0.100" (2.54mm)
Number of Positions:	36
Number of Rows:	1
Row Spacing - Mating:	--
Series:	BERGSTIK® II
Style:	Board to Board
Shrouding:	Unshrouded
Mounting Type:	Through Hole
Termination:	Solder
Fastening Type:	Push-Pull
Contact Length - Mating:	0.230" (5.84mm)
Contact Length - Post:	0.400" (10.16mm)

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Introduction

68418-136 is a highly-versatile connector system made up of a header and (male) pins. It is a rectangular connector system with pins capable of transferring Power, Signal and Ground simultaneously, as well as additional grounding options.68418-136 connectors are commonly found in board-to-wire and wire-to-wire applications where the need to transfer multiple signals is required. They are designed for long-term Contact retention and are ideal for applications where high-bandwidth valid signal integrity is critical.

Application Field and Working Principle

The 68418-136 connector system can be used in a wide range of applications, from telecommunications and networking to consumer electronics. It can be used for applications in which it is important to transmit Power, Signal and Ground simultaneously, as well as for additional grounding options.The 68418-136 connector system is made up of two parts. First is the header, which is used to cast the connection on the motherboard. The header has two rows of gold plated pins on the top which are inserted into a socket on the board. The second part is the (male) pins, which are press-fitted into the board. The 68418-136 connector consists of up to 68 pins in each row and are held in place using a shrouded soket.The main working principle of the 68418-136 connector system is to transfer Power, Signal and Ground simultaneously over a common interface. The pins are arranged in four minute segments, known as “Rows”. Each row consists of 16,18,20 pins. The pins are inserted into the board at 1,2,3,4,5,7,8,9,10and 11th rows in a clockwise direction. The 68418-136 connector has a contact retention feature of over 100 mating cycles.The Power, Signal and Ground pins are made of high-quality materials, designed to meet or exceed industry standards. The contacts are gold plated for increased conductivity, longevity, and secure mating. The contacts are also polarized to ensure proper mating.

Advantages

The 68418-136 connector system has several advantages over traditional board-to-wire connectors. It offers a smaller package footprint which makes it suitable for more compact applications. In addition, the connector system offers high-density contact arrangements for more efficient signal transfer. The pins are positioned in such a way that they maximize signal integrity and reduce cross-talk. The 68418-136 connector system also offers the benefits of high-contact retention, high insertability-extractability and improved efficiency. One of the biggest advantages is the capability of the connector system to transmit signal, power and ground simultaneously. This makes the 68418-136 a very versatile connector that can be used in a variety of applications.

Conclusion

The 68418-136 connector system is a highly versatile rectangular connector that is capable of transferring Power, Signal and Ground simultaneously. It is suitable for applications where high-bandwidth valid signal integrity is critical. The connector system offers a small package footprint, higher contact arrangements and improved signal integrity. It is an ideal solution for many board-to-wire and wire-to-wire applications.

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