68417W2102461

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D-Sub Connectors are multi-purpose connectors that are used to power a variety of devices. They are often used for computer systems, industrial machines, communications equipment, and other similar devices. The 68417W2102461 D-Sub connector is specifically designed for use in high-current applications. It can accommodate up to 7 pins and features insulation displacement contacts (IDCs) for secure connections.

The 68417W2102461 D-Sub connector’s simple construction makes it easy to use and versatile. It is constructed with two parts: the housing and the contacts. The housing is made from a molded, thermoplastic material and is designed to protect the contacts from damage or contamination. The contacts are made from electrogalvanized steel and are designed to withstand higher current applications.

The 68417W2102461 D-Sub connector’s insulation displacement contact (IDC) design makes it ideal for high-current applications. IDCs are essentially pieces of copper that are razor-sharp and can pierce through insulation on wires. This design allows for quick and secure connections when inserting wires into the connector. In addition, IDCs provide a low-resistance connection, which helps reduce electrical resistance and improves the efficiency of current flow.

The 68417W2102461 D-Sub connector’s simple construction and connection design make it suitable for a range of applications. It is often used in server systems, computer peripherals, medical equipment, industrial automation, communications, and a variety of other applications. Its insulated design and high-current capability make it a reliable choice for any application.

The 68417W2102461 D-Sub connector’s insulation displacement contact design allows for easy installation and secure connections. Its thermoplastic housing provides a durable and protective barrier from damage. Its high-current capability makes it suitable for a range of high-power applications. The 68417W2102461 D-Sub connector is a reliable and efficient solution for any application.

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