Allicdata Part #: | 68583-016LF-ND |
Manufacturer Part#: |
68583-016LF |
Price: | $ 4.82 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | 0.755 VERT HDR W/O MTG HOLE |
More Detail: | Connector Header Through Hole 40 position 0.100" (... |
DataSheet: | 68583-016LF Datasheet/PDF |
Quantity: | 1000 |
312 +: | $ 4.33157 |
Series: | BergCon® |
Packaging: | Tray |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 40 |
Number of Rows: | 2 |
Row Spacing - Mating: | 0.100" (2.54mm) |
Number of Positions Loaded: | All |
Style: | Board to Board |
Shrouding: | Shrouded - 4 Wall |
Mounting Type: | Through Hole |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.275" (6.99mm) |
Contact Length - Post: | 0.103" (2.62mm) |
Overall Contact Length: | 0.810" (20.57mm) |
Insulation Height: | 0.755" (19.18mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold, GXT™ |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Post: | -- |
Contact Material: | Phosphor Bronze |
Insulation Material: | -- |
Features: | -- |
Operating Temperature: | -- |
Ingress Protection: | -- |
Material Flammability Rating: | -- |
Insulation Color: | Black |
Current Rating: | -- |
Voltage Rating: | -- |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | -- |
Applications: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
68583-016LF is a type of rectangular connector which falls under the family of headers, male pins. It is part of Amphenol’s range of board-to-board connectors which are ideal for use in a variety of applications. From automotive and data communication to consumer, defence and industrial applications.
The 68583-016LF is designed for use in combination with the 68604 housing. This connector has a 2.00mm pitch and 16 circuits. It is made up of a compliant pin set, the 68584, mounted on a 68591 carrier. This part helps to save space and cost, while providing the desired application support.
The header is strongly resistant to the most extreme environmental factors such as earthquakes, dust, condensation, temperature, shock and vibration. This makes it suitable for a variety of applications where exposure to such elements is common. For instance, these connectors are often used in outdoor and military-spec applications.
The 68583-016LF header also utilises a stacking feature, which allows two compatible smt connectors to be stacked on top of one another. This enables the user to save space and cost when applying the connectors to their application. Additionally, the header features an industry standard configuration of 0.150" centers, allowing for compatibility with existing or standard board layouts.
The 68583-016LF is designed to provide excellent durability and reliability. Thanks to its contact-to-shorting design, the contact transition is smooth, fast and secure. This helps to ensure reliable operation and a longer lifespan of the connector. Furthermore, the spring leaf terminals have a long life and are designed to provide up to 20,000 mating cycles.
The 69583-016LF is also highly compatible with other vendors connectors and prototyping systems. Thanks to its standardised contact configuration, users can easily interchange the connector with other products from different vendors. The product is also available with various plating and termination options to meet the needs of any given applications.
All in all, the 68583-016LF is an ideal choice for applications requiring cost savings, durability and reliability. Its standardised configuration ensures compatibility with other vendors, while its spring contact design and 20,000 mating cycle guarantee that your application will have consistent performance over time. The header is also suitable for a variety of applications, from automotive to consumer, and is more than capable of handling any extreme environmental factors it may face.
The specific data is subject to PDF, and the above content is for reference
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