7-309-BA Allicdata Electronics
Allicdata Part #:

294-1014-ND

Manufacturer Part#:

7-309-BA

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK VERT W/TABS BLK TO-220
More Detail: Heat Sink TO-220 Aluminum 3.0W @ 80°C Board Level,...
DataSheet: 7-309-BA datasheet7-309-BA Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: 7
Part Status: Obsolete
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Shape: Rectangular, Fins
Length: 1.250" (31.75mm)
Width: 0.875" (22.22mm)
Diameter: --
Height Off Base (Height of Fin): 0.250" (6.35mm)
Power Dissipation @ Temperature Rise: 3.0W @ 80°C
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 31.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

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7-309-BA is a type of thermal - heat sink found in many industries, particularly where electronics are used in high-temperature applications. The heat sink is designed to dissipate and evenly distribute heat away from electronic components, allowing them to maintain optimal operating temperatures.

The 7-309-BA heat sink is a combination of a heat spreader and a radiator. The heat spreader contains an array of fins that help to spread out and evenly distribute heat. The radiator is typically a flat plate made from aluminum or copper, with a series of channels and ventilation holes that allow for air circulation.

The design of the 7-309-BA uses passive cooling, which does not require any outside source of energy or power. When the heat generated by the components is spread out through the heat spreader and dissipated by the radiator, the overall temperature of the component is lowered. Due to the passive cooling system, the 7-309-BA dissipates heat more quickly and efficiently than active cooling methods.

The 7-309-BA is typically used in a variety of electronic equipment, such as amplifier circuits, digital signal processing circuits, voltage regulators, and power controllers. It is also used to cool components in medical imaging, automotive braking systems, laser systems, and industrial automation. The heat sink can be used in other applications as well, depending on the needs of the application.

When installing the heat sink, special attention must be given to the airflow and the design of the airflow. Poor airflow can cause heat to become trapped in the device, leading to higher temperatures and potential overheating that could cause damage to components. It is important to plan the airflow carefully to ensure that the 7-309-BA can properly disperse the heat.

In addition, it is essential that the heat sink is properly sized and fitted for the application. If the heat sink is too big, the cooling efficiency of the device will be reduced, leading to higher temperatures. On the other hand, if it is too small, it will not be able to evenly spread out the heat and dissipate it quickly enough.

The 7-309-BA heat sink is a reliable and effective device for cooling and dissipating heat in a variety of applications. Its thermally efficient design allows for even heat distribution and quick dissipation to ensure optimal performance of electronics. Furthermore, it is easy to install and maintain, making it a popular choice for many industries.

The specific data is subject to PDF, and the above content is for reference

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