Series:	7
Part Status:	Obsolete
Type:	Board Level
Package Cooled:	TO-220
Attachment Method:	Bolt On and PC Pin
Shape:	Rectangular, Fins
Length:	0.682" (17.32mm)
Width:	1.750" (44.45mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	3.0W @ 50°C
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks: 7-323-BA Application Field and Working Principle

Heat sinks are an important part of cooling systems designed to dissipate the heat generated by electronic components. In today\'s world of high-powered computers, a great need exists for efficient heat sinks to prevent a component from being damaged due to overheating. The 7-323-BA is one such heat sink, capable of providing a reliable heat dissipation for high powered electronics.

Specifications:

The 7-323-BA is an aluminum heat sink designed to dissipate heat up to 200W. This heat sink has a special finning design which enables it to increase the surface area exposed to the surrounding air, thus increasing the cooling efficiency. The 7-323-BA is light yet durable, and can withstand temperatures up to 200°C (392°F). The dimensions of the heat sink are 3.15 x 1.65 x 0.71 inches (80 x 42 x 18 mm). The fins are 0.061 inches (2 mm) thick.

Application Field:

The 7-323-BA is primarily used for dissipating heat from high powered electronics found in both commercial and industrial applications. Examples of such applications include CPUs, cooling fans, power drives, power transistors, and switching regulators. The 7-323-BA can also be used in various industrial applications such as welding equipment, lab instruments, and medical equipment.

Working Principle:

Heat sinks work by allowing the heat from an electrical component to be dissipated into the surrounding air, thus keeping the component from overheating. This is accomplished by providing a larger surface area for the heat to dissipate into the air. The larger surface area of the 7-323-BA allows it to effectively absorb and dissipate the heat, thus cooling the component. The 7-323-BA heatsink is designed with additional fins which are intended to increase the surface area exposed to the air. This increase in surface area allows the heat to dissipate more effectively, and thus keep the system cool. In addition to the fins, the heat sink also has a unique core layout which is designed to disperse the heat energy more evenly across the entire fin surface. This helps ensure that all areas of the heat sink are exposed to the air, allowing the heat to be dissipated evenly.

Conclusion:

The 7-323-BA is an excellent heat sink for dissipating high amounts of heat from high powered electronics. The finning design and core layout enable the heat sink to provide an increased surface area for heat dissipation. This results in more efficient cooling, ensuring that the system is kept at a safe temperature. The 7-323-BA is suited for both commercial and industrial applications, as well as a variety of other applications.

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