7-339-3PP-BA Allicdata Electronics
Allicdata Part #:

294-1031-ND

Manufacturer Part#:

7-339-3PP-BA

Price: $ 2.01
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK PWR W/PINS BLACK TO-220
More Detail: Heat Sink TO-220 Aluminum 6.0W @ 40°C Board Level,...
DataSheet: 7-339-3PP-BA datasheet7-339-3PP-BA Datasheet/PDF
Quantity: 2226
1 +: $ 1.82700
10 +: $ 1.77975
25 +: $ 1.73200
50 +: $ 1.63573
100 +: $ 1.53947
250 +: $ 1.44325
500 +: $ 1.39515
1000 +: $ 1.25082
5000 +: $ 1.22676
Stock 2226Can Ship Immediately
$ 2.01
Specifications
Series: 7
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Shape: Rectangular, Fins
Length: 2.000" (50.80mm)
Width: 1.650" (41.91mm)
Diameter: --
Height Off Base (Height of Fin): 1.000" (25.40mm)
Power Dissipation @ Temperature Rise: 6.0W @ 40°C
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: 7.00°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is essential for electronic components and circuits that generate large amounts of heat from being operated. Pressure applied to these components helps to remove the heat quickly and evenly. The 7-339-3PP-BA heat sink is a popular option for thermal management in many electronics applications. This article will go over the working principle and application fields of the 7-339-3PP-BA heat sink to illustrate its versatility and practicality.

The 7-339-3PP-BA heat sink is a passive thermal management device consisting of an aluminum mounting platform and extrusions. The platform of the heat sink includes cutouts that allow for the easy removal of the extrusions when necessary. The pressure generated by the extrusions is distributed in an even manner, enabling efficient thermal management. The heat sink also features thermal dissipation pads that are used to help spread out any residual heat that is generated. These pads provide additional thermal transfer area, increasing cooling performance.

In addition to its unique heat sink design, the 7-339-3PP-BA thermal management solution offers several application fields for users. It is especially suited to thermal management of embedded boards, power systems, and other electronic components that require high thermal performance. With its high performance and relatively small size, the 7-339-3PP-BA heat sink is ideal for use in industrial, transportation, and automation systems.

The 7-339-3PP-BA heat sink is a simple, yet effective, thermal management solution. It distributes the applied pressure evenly, enabling an efficient removal of heat and assisting with thermal performance. Its versatility and practicality make the 7-339-3PP-BA heat sink applicable to a wide range of electronics products, making it an ideal choice for many thermal management solutions.

The specific data is subject to PDF, and the above content is for reference

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