
Allicdata Part #: | 294-1035-ND |
Manufacturer Part#: |
7-340-3PP-BA |
Price: | $ 1.87 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | HEATSINK PWR HORZ BLACK TO-220 |
More Detail: | Heat Sink TO-220 Aluminum 3.0W @ 40°C Board Level |
DataSheet: | ![]() |
Quantity: | 560 |
1 +: | $ 1.70100 |
10 +: | $ 1.65564 |
25 +: | $ 1.61129 |
50 +: | $ 1.52170 |
100 +: | $ 1.43212 |
250 +: | $ 1.34263 |
500 +: | $ 1.29789 |
1000 +: | $ 1.16362 |
5000 +: | $ 1.14124 |
Series: | 7 |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On |
Shape: | Rectangular, Fins |
Length: | 0.750" (19.05mm) |
Width: | 1.150" (29.21mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.460" (11.68mm) |
Power Dissipation @ Temperature Rise: | 3.0W @ 40°C |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | 15.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal management is an important factor in the performance and reliability of various electronic systems, components and products. Heat sink is a critical component for efficient thermal management. One example is the 7-340-3PP-BA heat sink which is designed for optimal heat dissipation and thermal management in a variety of applications.
The 7-340-3PP-BA heat sink is a double-sided aluminum-finned heat sink with a bottom plate that has three thermoplastic (PP) legs for mounting on a printed circuit board. It has a length of 95mm and an effective heat-dissipating area (top and bottom) of 340sq cm. The product is an optimal solution for applications requiring high thermal performance at relatively small size. The rib spines of the heat sink, combined with the fin structure, enhance heat dissipation and increase the thermal performance of the heat sink.
The 7-340-3PP-BA heat sink is ideal for use in medical and industrial applications, such as PC Server, Telecom Enclosures, Fanless PC\'s, LEDs, Industrial Lighting, Notebook/Desktop Computers, and consumer electronics, such as LCD/Plasma TVs, Set-top Boxes, Satellite Receivers, Hard Drives, Power Stations, Modems, and more.
This versatile heat sink is designed to passively dissipate heat away from heat-generating components with greater efficiency than a simple conventional heat sink. It offers superior thermal performance, greater cooling surface, and excellent temperature uniformity over a wide range of operating conditions.
The 7-340-3PP-BA heat sink uses a patented heat transfer technology, called Thermal Grease Interface (TGII), to shuttle heat between a thermally conductive base plate and the fins. TGII is an advanced ceramic-based thermal interface material that enhances thermal conductivity and conforms to the heat sink surfaces for improved thermal performance. Each leg is made of polypropylene and wraps around the sides of the heat sink providing a secure mount to the board.
The heat sink is also designed with a snap-in clip system for fast, secure installation. The clip snaps into place over tabs at the base of the heat sink and allows easy installation to the main board. The design also provides several advantages such as quick assembly, secure fitting, and high stability.
The 7-340-3PP-BA heat sink can be used in a variety of applications to reduce the risk of component overheating, increased power dissipation, and even component failure. It implies that the heat sink can protect components from damaging levels of heat, allowing them to remain within their operational temperature range, thus minimizing the risk of component damage and providing consistent, reliable performance.
A variety of other advanced methods and features can also be used in conjunction with the 7-340-3PP-BA heat sink to further improve thermal performance. These include using liquid cooling systems, air-flow circulation systems, and specially designed fan shrouds.
In conclusion, the 7-340-3PP-BA heat sink is a versatile thermal solution designed for optimal heat dissipation and thermal management. Its patented TGII technology enables superior thermal performance, while its efficient mounting system ensures secure fitting and stable operation. This heat sink offers several advantages for a variety of applications and can help reduce the risk of component overheating, increased power dissipation, and component failure.
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