
Allicdata Part #: | 294-1077-ND |
Manufacturer Part#: |
7-404-000-BA |
Price: | $ 0.00 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | HEATSINK PWR HORZ 1.5"H BLACK |
More Detail: | Heat Sink TO-220 Aluminum 15.0W @ 50°C Board Level |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | 7 |
Part Status: | Obsolete |
Type: | Board Level |
Package Cooled: | TO-220 |
Attachment Method: | Bolt On |
Shape: | Square, Fins |
Length: | 1.780" (45.21mm) |
Width: | 1.780" (45.21mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.500" (38.10mm) |
Power Dissipation @ Temperature Rise: | 15.0W @ 50°C |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal - Heat Sinks
The 7-404-000-BA is a heat sink designed to transfer or dissipate thermal energy from electronic components such as microprocessors, transistors, and diodes. Heat sinks are used in order to maintain the temperature of the device they are attached to within a temperature range in order to prevent performance degradation or damage. The 7-404-000-BA heat sink is designed to be used in low current applications such as low wattage integrated circuit chips and low wattage power amplifiers.
Heat sinks are usually constructed out of metal, such as copper or aluminum, and have a finned surface in order to increase the surface area over which heat can be dissipated. The fins create a larger surface area for the air to come in contact with, which helps to transfer heat away from the device being cooled. The 7-404-000-BA heat sink is made from copper and has a finned surface which helps greatly in dissipating the thermal energy away from the device.
The 7-404-000-BA heat sink is designed to fit on low power applications, such as integrated circuit chips which generate low levels of heat. It has a low profile design, measuring just over 1/2 inch in height and covering an area of 2.25 square inches and can be attached using screws or adhesive tape. The low profile design of the 7-404-000-BA allows it to be used in devices where space is limited.
The 7-404-000-BA heat sink works by using convection to transfer the thermal energy away from the device being cooled. Convection is the process by which heat is transferred from a hot surface to a colder surface through the air or other fluid surrounding the device. The fins on the surface of the 7-404-000-BA increase the surface area for air to come in contact with, which helps to dissipate the thermal energy away from the device more quickly. The 7-404-000-BA can also be used in combination with a fan to further increase the rate of heat transfer.
Heat sinks are an important component in any electronic device and are necessary for allowing the device to perform at its optimum performance. The 7-404-000-BA is an effective solution for cooling devices which generate low levels of heat. With its low profile design and efficient heat dissipation, the 7-404-000-BA is an ideal choice for applications where space is limited.
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