7025BG

Series:	--
Part Status:	Active
Type:	Board Level, Vertical
Package Cooled:	TO-220
Attachment Method:	Bolt On and PC Pin
Shape:	Rectangular, Fins
Length:	1.130" (28.70mm)
Width:	1.900" (48.26mm)
Diameter:	--
Height Off Base (Height of Fin):	0.950" (24.13mm)
Power Dissipation @ Temperature Rise:	6.0W @ 50°C
Thermal Resistance @ Forced Air Flow:	4.00°C/W @ 300 LFM
Thermal Resistance @ Natural:	6.80°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Introduction to 7025BG Application Field and Working PrincipleThermal - Heat Sinks are a type of cooling device commonly used in electronics to dissipate heat generated by components such as processors, power supplies, resistors, etc. The 7025BG Heat Sink is a specialty type of Heat Sink designed to provide superior cooling capacity, durability, and performance.What is the 7025BG Heat Sink?The 7025BG Heat Sink is a specialized type of Heat Sink designed to maximize cooling capacity and improve heat dissipation. The 7025BG Heat Sink is constructed from readily available copper or aluminum materials and features a unique trapezoid shape that maximizes surface area and ensures optimal air flow over the surface of the heat sink, allowing for improved heat transfer from the surface of the heat sink to the surrounding air. The shape of a 7025BG Heat Sink also reduces the possibility of dust or debris collecting on the surface, which can reduce overall cooling capacity.7025BG Application FieldThe 7025BG Heat Sink is most commonly used in a variety of electronic components and assemblies, such as:• Personal computer systems and other electronics• Video game consoles and other gaming equipment• Solid-state drives and other flash storage media• Printers and other peripheral devices• Industrial equipment• scientific instruments• medical equipmentThe 7025BG Heat Sink is ideal for use in applications where the need for superior coolingcapacity is paramount such as high-performance gaming systems, data centers, servers, and other high-demand electronic applications.7025BG Working PrincipleThe 7025BG Heat Sink works by transferring heat from the component being cooled to the air circulating around the component, a process known as convection. This process is made possible by air passing over the surface of the 7025BG Heat Sink, creating a thermal gradient between the air and the surface of the heat sink. As the air passes over the surface, it collects heat from the heat sink and carries it away with the air flow. This causes a decrease in temperature on the surface of the heat sink, which in turn leads to a decrease in temperature of the component being cooled.The 7025BG Heat Sink also works by increasing the surface area of the heat sink, allowing for greater cooling capacity. The larger surface area of the 7025BG Heat Sink helps to dissipate more heat away from the component being cooled, resulting in improved thermal performance.Ultimately, the 7025BG Heat Sink helps to optimize temperature stability by providing a higher cooling capacity and reducing ambient air temperatures by dissipating heat away from the component being cooled.ConclusionThe 7025BG Heat Sink is an ideal thermal solution for a wide variety of electronic systems and assemblies, offering superior cooling capacity, durability, and performance. This versatile Heat Sink works by combining convection and increased surface area to dissipate heat away from the component being cooled, optimizing temperature stability and improving performance. Given its impressive capabilities and wide range of applications, the 7025BG is an excellent choice when it comes to cooling electronic systems.

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