70430-159LF

Series:	Metral®
Packaging:	Tube
Lead Free Status / RoHS Status:	--
Part Status:	Active
Moisture Sensitivity Level (MSL):	--
Connector Usage:	--
Connector Type:	Header, Male Blades
Connector Style:	Blade Power
Number of Positions:	10
Number of Positions Loaded:	All
Pitch:	0.236" (6.00mm)
Number of Rows:	5
Number of Columns:	--
Mounting Type:	Through Hole
Termination:	Press-Fit
Contact Layout, Typical:	10 Power
Features:	--
Contact Finish:	Gold
Contact Finish Thickness:	30.0µin (0.76µm)
Color:	--
Current Rating:	--
Material Flammability Rating:	UL94 V-0
Operating Temperature:	--
Voltage Rating:	--

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Introduction

The 70430-159LF is a special-purpose backplane connector used for high-density applications. It provides enhanced signal integrity and improved power delivery in server, storage and other high-performance applications. Unlike most other backplane connectors, the 70430-159LF incorporates a unique design that uses staggered heights to increase current carrying capacity and minimize crosstalk. As a result, the 70430-159LF offers a better solution for high-density applications.

Overview Of The 70430-159LF

The 70430-159LF is an enhanced connector designed to reduce signal loss and improve current delivery. It is a flat-type connector, with two rows of staggered, alternating contact heights. The staggered height of the contacts results in a higher contact density, which increases current-carrying capacity and reducing crosstalk. In addition, the staggered heights also provide greater solder joint strength and improved noise immunity.The 70430-159LF is available in a variety of different configurations, with each providing unique features to meet the needs of a wide range of applications. It has a contact pitch of 0.8 mm and can be used with either PCB-mounted or panel-mounted cables. The design also supports hot swap, stack through, flex and multiple stack-through applications.

Applications Of The 70430-159LF

The 70430-159LF is designed to meet the demands of high-density, high-performance applications. As such, it is an ideal connector for a variety of applications, including servers, storage, multi-gigabit communications, and other high-speed data-intensive systems.In addition, the 70430-159LF is also well-suited for use in combination with other connectors, such as SATA, SAS, FMC and FMC+. This makes it an ideal choice for applications that require a high level of data throughput, such as Enterprise Ethernet, Infiniband, and Fibre Channel.Finally, the 70430-159LF has excellent thermal performance, making it a great choice for applications that generate a significant amount of heat. Its low profile design and increased current-carrying capacity also make it well-suited for use in space-constrained applications.

Working Principle Of The 70430-159LF

The 70430-159LF backplane connector works by providing enhancements in signal integrity and improved current delivery. This is accomplished by the use of the staggered contact heights, which provide increased contact density and reduced crosstalk. In addition, the increased solder joint strength and improved noise immunity provided by the design also improve the performance of the connector.The 70430-159LF also utilizes a series of contact spring-loaded contacts, which are designed to help prevent displacement, misalignment and unintended disconnects. This ensures maximum performance and reliability in any application.

Conclusion

The 70430-159LF is a specialized backplane connector offering enhanced signal integrity and improved power delivery. It is designed for use in a variety of demanding applications, including servers, storage, and multi-gigabit communications. The 70430-159LF also utilizes a unique design, with staggered heights that increase contact density and reduce crosstalk. In addition, its high current-carrying capacity, improved solder joint strength, and improved noise immunity make it an ideal choice for space-constrained applications. Finally, the spring-loaded contacts ensure maximum performance and reliability, making it an excellent choice for high-performance applications.

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