7109DG

Series:	--
Part Status:	Active
Type:	Top Mount
Package Cooled:	TO-263 (D²Pak)
Attachment Method:	SMD Pad
Shape:	Rectangular, Fins
Length:	0.763" (19.38mm)
Width:	1.000" (25.40mm)
Diameter:	--
Height Off Base (Height of Fin):	0.450" (11.43mm)
Power Dissipation @ Temperature Rise:	2.0W @ 30°C
Thermal Resistance @ Forced Air Flow:	3.00°C/W @ 300 LFM
Thermal Resistance @ Natural:	11.00°C/W
Material:	Copper
Material Finish:	Tin

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Introduction

Heat sinks are devices that are used to regulate the temperature of electronic components. They are designed to absorb and dissipate heat generated by the components. Thermal management is a crucial factor in the successful operation of these components and heat sinks are a reliable and cost-effective way to manage the temperature of electronics. The 7109DG model from TE Connectivity is an ideal solution for thermal management in the fields of telecommunications, industrial automation, computer, and automotive applications.

7109DG Application Field

The 7109DG from TE Connectivity is a cost-effective, highly reliable thermal-management solution that is Ideal for active components like CPUs, GPUs, and memory. It is also an economical solution for peak component temperatures in the telecommunications, industrial automation, computer, and automotive industries. This heat sink model provides excellent user-friendliness for component manufacturers and users.The 7109DG is designed for maximum efficiency and is able to dissipate heat in small spaces. Its high performance in moving heat away from components and drawing it away to the atmosphere enables it to automatically adjust as temperatures rise and fall. Its robust design allows for extended operating times without performance degradation. Its adjustable mounting options provide flexibility for greater component protection and customer satisfaction. The 7109DG can be configured to meet any need, making it the perfect thermal-management solution for a wide range of applications.

7109DG Working Principle

The 7109DG heat sink follows an effective design whereby heat is absorbed and dissipated by the epoxy-filled aluminum core, thermal interface material (TIM), and metal fins. Heat is first absorbed by the aluminum core which then transfers the heat to the TIM where it can be further transferred to the metal fins. The metal fins act as a radiator, dissipating the heat into the atmosphere. The amount of heat dissipated is determined by the size, shape, and number of fins.The 7109DG also utilizes high-efficiency fans which are highly efficient at moving air, creating a highly efficient air convection. This enhances the cooling performance, allowing the heat sink to keep components running at peak operation. The fan’s design and size further provide noise reduction, making it an ideal choice for applications that require quiet operations.

Conclusion

The 7109DG from TE Connectivity is a reliable and cost-effective solution for thermal management in the fields of telecommunications, industrial automation, computer, and automotive applications. It is designed for maximum efficiency and is able to dissipate heat in small spaces, while its adjustable mounting options provide flexibility for greater component protection and customer satisfaction. The 7109DG’s effective design, high performance, and noise-reducing fan make it the perfect thermal-management solution for a wide range of applications.

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