73983-1001LF Allicdata Electronics
Allicdata Part #:

73983-1001LF-ND

Manufacturer Part#:

73983-1001LF

Price: $ 3.12
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: METRAL 1000 SIG HDR STR PF 5X6
More Detail: N/A
DataSheet: 73983-1001LF datasheet73983-1001LF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
384 +: $ 2.84371
Stock 1000Can Ship Immediately
$ 3.12
Specifications
Series: Metral® 1000
Packaging: Tube 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Header, Male Pins
Connector Style: High Speed
Number of Positions: 36
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Columns: --
Mounting Type: Through Hole
Termination: Press-Fit
Contact Layout, Typical: 30 Signal, 6 Ground
Features: Shielded
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Color: Natural
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Operating Temperature: -55°C ~ 105°C
Voltage Rating: --
Description

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Backplane Connectors - Specialized

The 73983-1001LF is a specialized backplane connector, designed for high-density applications and featuring both increased speed and improved signal integrity in dense backplane connections. This type of connector has a broad range of applications, from small electronics boards to high-end, complex systems. In this article, we will take a closer look at the 73983-1001LF connector, its application field and working principle.

Application Field

The 73983-1001LF backplane connector is specifically designed to provide increased speed and signal integrity in dense backplane connections. It features a unique, pitch-less arrangement for high-speed data transfer. This allows for more efficient communication between components, as well as improved power efficiency and fault-tolerant operation. Furthermore, it is designed to ensure low crosstalk and enable increased system performance.

The 73983-1001LF is suitable for a wide range of applications, including network switches, storage systems, embedded systems, and video applications. It is commonly used in high-end, high-density enclosures used in medical and industrial applications. In addition, it can be used in the automotive industry, offering both reliability and cost savings.

Working Principle

The 73983-1001LF backplane connector utilizes a unique, pitch-less arrangement of four communication lines, arranged into two pairs. This reduces the number of connections and increases speed by reducing signal delays. It also improves signal integrity by providing better crosstalk rejection, improved power efficiency and increased system performance.

The pitch-less architecture of the 73983-1001LF reduces the number of connections required, making it suitable for high-density backplane applications. This is achieved through the use of two boards connecting to each other. The first board, or the “wallboard”, has the 73983-1001LF connector, which connects to the second board, known as the “daughterboard”. The daughterboard carries all of the required components, such as transistors, diodes and capacitors. This arrangement will allow for the most efficient transfer of information between components.

In addition to its pitch-less architecture, the 73983-1001LF also features improved signal integrity by utilizing surface mount technology. This allows for better pin-to-pin connections and improved heat resistance, which leads to increased system performance. Furthermore, the 73983-1001LF is designed to reduce crosstalk and prevent EMI leakage, which can be beneficial for applications where noise is a concern.

Conclusion

The 73983-1001LF is a specialized backplane connector, designed for high-density applications and featuring both increased speed and improved signal integrity. It is suitable for a wide range of applications, from small electronics boards to high-end, complex systems. The 73983-1001LF utilizes a unique, pitch-less arrangement of four communication lines and utilizes surface mount technology for improved signal integrity. Additionally, it is designed to reduce crosstalk and ensure low EMI leakage, making it an ideal solution for high-density applications.

The specific data is subject to PDF, and the above content is for reference

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