Allicdata Part #: | 73993-101LF-ND |
Manufacturer Part#: |
73993-101LF |
Price: | $ 1.74 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | METRAL 1000 HDR SHRD 1MOD 5ROW |
More Detail: | N/A |
DataSheet: | 73993-101LF Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
384 +: | $ 1.58991 |
Series: | Metral® 1000 |
Packaging: | Tube |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Connector Usage: | -- |
Connector Type: | Header, Male Pins |
Connector Style: | High Speed |
Number of Positions: | 36 |
Number of Positions Loaded: | All |
Pitch: | 0.079" (2.00mm) |
Number of Rows: | 5 |
Number of Columns: | -- |
Mounting Type: | Through Hole |
Termination: | Press-Fit |
Contact Layout, Typical: | 30 Signal, 6 Ground |
Features: | Shielded |
Contact Finish: | Gold |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Color: | Natural |
Current Rating: | 1A |
Material Flammability Rating: | UL94 V-0 |
Operating Temperature: | -55°C ~ 105°C |
Voltage Rating: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The 73993-101LF is a specialized backplane connector designed to handle high density data and signal transmissions. It is often used in applications that require tight packing and high expertise. This connector is known for its superior performance in high-density and high-speed data transmission applications.
The 73993-101LF is a connector specifically designed to support a wide range of applications requiring dense and fast transmission of data and signals. Its inner contact conductor features a spacing of 1.25 mm between the pin contacts, allowing for high-density data transmissions. It also offers improved power distribution and an ability to reject high interference. This effectively eliminates cross-talk and distortion.
The 73993-101LF is a multi-layered, heterogeneous device. This implies that there are several different conductor layouts, each with a specific design and purpose. The various layers are designed for specific functions and features. The individual elements are connected by a copper alloy body and solder joints. This enables the device to divide and direct electrical signals to where they are needed.
The 73993-101LF also features a range of specialized contact interconnects and springs to ensure reliable and consistent performance. Its base supports an array of stamped features that ensure direct contact between the contacts and their point-to-point connections. The combination of these features ensures a high degree of flexibility and reduces the chances of electrical noise or data degradation.
Furthermore, the 73993-101LF is able to perform under extreme temperature conditions, allowing it to be used in certain industrial and high-performance applications. It is constructed of common industrial grade of plastic for durable connections. It also offers resistance to electrical, chemical, and environmental damage, providing a longer lifetime.
The 73993-101LF is highly suitable for a wide range of applications including backplanes. The wide variety of multi-layered conductor layouts and contact interconnects offers flexibility, allowing engineers to design custom backplane connections to meet their specific requirements. The contacts are able to reliably handle high-speed data transmissions and provide a dependable connection.
Overall, the 73993-101LF offers superior performance and flexibility due to its multi-layered design and specialized features. It provides reliable data transmissions and is suitable for a variety of applications, including backplanes. Its features include high-density contact interconnects, a copper alloy body, and durable plastic structure. Its capability to withstand high temperatures and robust construction make it suitable for industrial and high-performance applications.
The specific data is subject to PDF, and the above content is for reference
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