77315-824-26LF Allicdata Electronics
Allicdata Part #:

77315-824-26LF-ND

Manufacturer Part#:

77315-824-26LF

Price: $ 0.89
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: BERGSTIK
More Detail: Connector Header Through Hole, Right Angle 26 posi...
DataSheet: 77315-824-26LF datasheet77315-824-26LF Datasheet/PDF
Quantity: 1000
400 +: $ 0.80007
Stock 1000Can Ship Immediately
$ 0.89
Specifications
Operating Temperature: --
Insulation Height: 0.094" (2.40mm)
Contact Shape: Square
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Thermoplastic
Features: --
Overall Contact Length: --
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Applications: --
Number of Positions Loaded: All
Packaging: Bulk 
Part Status: Active
Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 26
Number of Rows: 1
Row Spacing - Mating: --
Series: BERGSTIK®
Style: Board to Board
Shrouding: Unshrouded
Mounting Type: Through Hole, Right Angle
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.266" (6.75mm)
Contact Length - Post: 0.112" (2.84mm)
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Rectangular connectors, headers, and male pins are common and ubiquitous components in the modern world of Electronics and Computer Hardware. From the smallest PC boards to the most complex networking cards, they are found in most electronic devices. The 77315-824-26LF is a such connector, and its application field and working principle can be discussed.

The 77315-824-26LF is a four-row, surface mountable, ultra-low profile, high-density pin header. It was designed for usage in high-density electronic packages, such as those found in miniaturized and ultra-slim digital products. It has 4 rows of 8 contacts with alternating offset positions, a pitch of 0.5mm, and it mates with a mating socket.

The 77315-824-26LF’s application field covers miniaturization, including portable media players, PDAs, GPS devices, cellular phones, MP3 players, and digital cameras. It is also suitable for use in computer hardware, such as motherboards, slim form factor HMs, or external device enclosures. It is also used in industrial, automotive, and medical related products.

This connector’s design facilitates a high-density placement of contacts in as minimum space as possible. This is achieved through the contacts’ side-injected contact structure, which provides reliable electrical contact and secure mechanical retention. The offset-pattern gains high degrees of dependability while maintaining low profile (≦ 2mm) and high contact density, since it eliminates the need for overlapping contact structures that can potentially damage the contacts. Also, it was designed with a two-bevel locking system above the contact’s length to ensure a secure mating.

The overall construction of the 77315-824-26LF is metal-shell with insulation material. The material provides good performance under high-temperature situations, which makes it suitable for products with heat sensitive parts. Additionally, its overall construction provides efficient grounding and shielding, suitable for low-eMI applications. The crimping process is used for connecting the wire to the contact but it can also be soldered, if needed.

In conclusion, the 77315-824-26LF rectangular connector is a high-density pin header suitable for miniaturized and ultra-slim digital products. It can also be used for industrial, automotive, and medical related products, as well as computers and various hardware. It offers a low profile construction with four rows of 8 contacts with alternating offset positions. Its design facilitates excellent performance under high temperatures, while providing secure mechanical retention and EMI shielding.

The specific data is subject to PDF, and the above content is for reference

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