8080-1G1-LF Allicdata Electronics
Allicdata Part #:

A136854-ND

Manufacturer Part#:

8080-1G1-LF

Price: $ 14.34
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN TRANSIST TO-3 3POS TIN
More Detail: N/A
DataSheet: 8080-1G1-LF datasheet8080-1G1-LF Datasheet/PDF
Quantity: 1000
1 +: $ 13.04100
10 +: $ 11.77220
25 +: $ 11.27850
50 +: $ 10.57360
100 +: $ 10.22110
250 +: $ 9.65720
500 +: $ 9.37524
Stock 1000Can Ship Immediately
$ 14.34
Specifications
Features: Closed Frame
Contact Resistance: --
Material Flammability Rating: --
Termination Post Length: --
Operating Temperature: -55°C ~ 125°C
Housing Material: Polytetrafluoroethylene (PTFE)
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: --
Termination: Solder
Series: 8080
Mounting Type: Chassis Mount
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin
Pitch - Mating: --
Number of Positions or Pins (Grid): 3 (Oval)
Type: Transistor, TO-3
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for integrated circuits, transistors and other small, specialized electronic components are vital in a wide range of industries and applications. Without the use of sockets, these components are exposed to shocks, vibrations, and environmental elements that can damage them, resulting in catastrophic consequences for the modeled system or device. The 8080-1G1-LF is an special type of socket designed for applications such as automotive, industrial, and military installations. It is capable of withstanding severe temperature fluctuations, vibration, mechanical shock, electrical shock, and other environmental dangers.

The 8080-1G1-LF uses a standard DIP package and is equipped with an 8-pin connection adapter. This allows the device to be connected to applications such as data and alarm systems, relays, transistors, microcontrollers, and digital signal boards. It features a universal contact pattern, which ensures a reliable connection between the socket and the components it hold. This makes it an excellent choice for high-density boards or applications where space is limited.

The 8080-1G1-LF can be used in a wide variety of applications. In automotive, industrial, and military uses, it can be used for mounting electronic components on PCBs. It can also be used in boards used in medical, communication, and surveillance systems. Its quick and simple installation makes it well suited for rapid prototyping of electronic devices.

The 8080-1G1-LF is able to withstand extreme temperature changes, mechanical stress, and other environmental hazards, making it an ideal choice for harsh environments. The socket is also coated with an ESD protective layer, which helps prevent electrical damage to the components it holds. Its robust construction helps to prevent vibrations, shocks, and environmental elements from impacting the performance of the components.

The 8080-1G1-LF has a wide working range of between -40°C and +105°C and features a hermetically sealed design. This ensures that the contact fingers remain intact, minimizes the risk of shorting, and provides optimal electrical performance. Additionally, the socket has a maximum current rating of 1A per pin, making it suitable for a variety of low-power applications.

In conclusion, the 8080-1G1-LF is an ideal choice for use in automotive, industrial, and military applications as well as a variety of other installations. It is designed to withstand temperature fluctuations, vibrations, mechanical shock, electrical shock, and other environmental conditions, and its hermetically sealed design helps to minimize the risk of shorting or other electrical damage. This makes the 8080-1G1-LF an ideal choice for applications where reliable contact is needed in tight spaces or harsh environments.

The specific data is subject to PDF, and the above content is for reference

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