
Allicdata Part #: | 8114LB603G-ND |
Manufacturer Part#: |
8114LB603G |
Price: | $ 2.07 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | HEATSINK |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
1000 +: | $ 1.88288 |
Features: | -- |
Contact Resistance: | -- |
Material Flammability Rating: | -- |
Termination Post Length: | -- |
Operating Temperature: | -- |
Housing Material: | -- |
Contact Material - Post: | -- |
Contact Finish Thickness - Post: | -- |
Contact Finish - Post: | -- |
Pitch - Post: | -- |
Termination: | -- |
Series: | -- |
Mounting Type: | -- |
Contact Material - Mating: | -- |
Contact Finish Thickness - Mating: | -- |
Contact Finish - Mating: | -- |
Pitch - Mating: | -- |
Number of Positions or Pins (Grid): | -- |
Type: | -- |
Part Status: | Active |
Packaging: | -- |
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The 8114LB603G is a miniaturized socket for integrated circuits, transistors, and other electronic components. It is a surface mount DIP type socket and can be used in a variety of applications. The 8114LB603G socket provides a reliable connection between the chip and the printed circuit board (PCB) and is commonly used in small electronic systems.
The socket is made of a robust and durable UL 94V-2 compliant polypropylene housing material that offers excellent insulation properties and excellent chemical resistance. It features an array of relatively shallow mating pins that are arranged in two sets; one set for data, and the other set for ground. The pins are 0.45mm (0.018”) diameter and have a 0.2mm (0.008”) pitch. This ensures maximum contact reliability, even in high vibration environments. The socket also features an adjustable backpin contact mechanism that can be mechanically or electrically adjusted to conform to the PCB height.
The 8114LB603G socket is designed for use in a variety of applications. It is commonly used for memory chips, power transistors, and other electronic devices. It is highly compatible with a range of electronic circuits, including but not limited to DRAM (dynamic random access memory) chips, LEDs (light emitting diodes) and CMOS (complementary metal–oxide–semiconductor) chips. It is also very suitable for printed circuit board (PCB) applications that require frequent signal transmission and/or switching. Additionally, it is well suited for applications requiring low assembly time and cost.
The 8114LB603G socket features a unique working principle that works by applying a pressure to one set of pins, known as the actuator pins and another set of pins known as the target pins. When the actuator pins are pressed, the target pins are released, thereby causing an electrical connection between the two sets of pins. This results in a current flow between the connected pins, thereby making the connection work. The working principle of the 8114LB603G socket is based on mechanical contact closure which allows for reliable and continuous electrical contact.
The 8114LB603G socket has many advantages that makes it suitable for a wide range of electronic applications. It features a standard 0.45mm (0.018”) diameter and 0.2mm (0.008”) pitch pin layout that is suitable for a variety of electronic components. Moreover, its adjustable backpin contact mechanism ensures reliable connection between the chip and the PCB. It also has a small size and low profile that makes it suitable for space-constrained applications. Additionally, it is well-suited for automated assembly and is RoHS compliant. Furthermore, its UL 94V-2 compliant housing material ensures excellent insulation properties and excellent chemical resistance.
The 8114LB603G socket is an ideal choice for applications requiring reliable connections between chips and printed circuit boards. Its working principle is based on mechanical contact closure, which ensures reliable and continuous electrical contact. Moreover, its small size and low profile make it suitable for space-constrained applications. Additionally, its UL 94V-2 compliant housing material ensures excellent insulation properties and excellent chemical resistance. Its adjustable backpin contact mechanism also ensures reliable connections between the chip and the PCB.
The specific data is subject to PDF, and the above content is for reference
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