822064-5 Allicdata Electronics
Allicdata Part #:

A109509-ND

Manufacturer Part#:

822064-5

Price: $ 6.45
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN SOCKET PQFP 132POS TIN-LEAD
More Detail: N/A
DataSheet: 822064-5 datasheet822064-5 Datasheet/PDF
Quantity: 1000
768 +: $ 5.86601
Stock 1000Can Ship Immediately
$ 6.45
Specifications
Features: Closed Frame
Contact Resistance: --
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.135" (3.43mm)
Operating Temperature: --
Housing Material: Liquid Crystal Polymer (LCP)
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.025" (0.64mm)
Termination: Solder
Series: --
Mounting Type: Through Hole
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.025" (0.64mm)
Number of Positions or Pins (Grid): 132 (4 x 33)
Type: QFP
Part Status: Active
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors are used for many different applications including many of the chips used in a circuit board. The 822064-5 application field and working principle will focus on how the socket is used and the details of how it works to make sure that a chip is properly seated and that the correct voltage is supplied to the chip.

The 822064-5 socket is a pressure clamp socket designed to hold integrated circuits, small transistors, and other contacts. This socket is designed to hold chips that are half a square inch (5 cm2) or smaller. The socket is designed to protect chips from accidental mechanical damage such as static discharge and other hazards. It also stops the chip from moving within the circuit board and thus damaging the circuit.

The 822064-5 socket uses a pressure clamp which consists of several layers of metal or plastic plates that are press fitted together. The pressure clamp is designed to press the chips firmly against the contact pads in the circuit board. This ensures that the correct pressure is applied, and that the chip is held securely in place. The socket is fitted with a thermal grease layer which helps to dissipate the heat generated by the chip.

In order to use the 822064-5 socket properly, it must be placed into the circuit board firmly. The pressure clamp must be firmly pressed against the contact pads on the circuit board. Once the pressure clamp is in place, the chip can be inserted into the socket. The socket ensures that the correct voltage is supplied to the chip, and that it is held securely in place against the contact pads. The pressure clamp also helps to ensure that the chip is not damaged from mechanical shocks or static discharge.

When using the 822064-5 socket, it is important to check the voltage specifications of the chip that is to be used. The socket must be capable of providing the correct voltage that the chip requires. The voltage requirements are usually printed on the chip itself. The voltage supplied by the socket must also be in accordance with the voltage range marked on the chip.

When the socket is in use, the contacts should be checked regularly to make sure that they are not worn or damaged. The contacts should be clean and free from corrosion. If there is any damage to the contacts then they should be cleaned and replaced. If the socket needs to be moved or adjusted in any way, it should be done with caution and with the correct tools in order to prevent damage to the chip.

The 822064-5 socket is an important device for applications requiring the use of integrated circuits, transistors, and other contacts. It ensures that the correct voltage is being supplied to the chip, and that it is held securely in place within the circuit board. The pressure clamp ensures that the chip is not damaged from accidental mechanical shocks, and helps to dissipate the heat generated by the chip.

The specific data is subject to PDF, and the above content is for reference

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