Allicdata Part #: | 84535-191LF-ND |
Manufacturer Part#: |
84535-191LF |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | CONN ARRAY FEMALE 200POS SMD |
More Detail: | 200 Position Connector Array, Female Sockets Surfa... |
DataSheet: | 84535-191LF Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | MEG-Array®, MezzSelect™ |
Packaging: | Tape & Reel (TR) |
Part Status: | Active |
Connector Type: | Array, Female Sockets |
Number of Positions: | 200 |
Pitch: | 0.050" (1.27mm) |
Number of Rows: | 10 |
Mounting Type: | Surface Mount |
Features: | -- |
Contact Finish: | Gold, GXT™ |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Mated Stacking Heights: | 8mm, 14mm |
Height Above Board: | 0.289" (7.35mm) |
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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
The 84535-191LF is an array-style, edge-type, board-to-board mezzanine connector. It is designed to extend the reach of board-to-board application connections between two mating circuit boards. This connector is a good choice for applications where space limitations are a concern, since its design helps reduce component and design size by minimizing board-to-board separation height.
Application Field
The 84535-191LF is designed for use in applications that require high-density, high-speed board-to-board connections. The mezzanine technology employed by this connector allows it to bridge four electrical contact points and reach up to five signal layers. Board-to-board connections are usually seen in applications like computer peripherals, consumer electronics, medical systems, LAN systems, and telecommunications.
Working Principle
The 84535-191LF features the patented mezzanine technology, which provides for two crossed arrays of phased contact pads between two boards. The contact pads are integrated and staggered to ensure positive contact even during misalignment indications. It consists of a two-piece structure which includes a socket-style board with an array housing. The large lead pitch of the 84535-191LF helps ensure reliable connection even in high shock, vibration, and temperature environments.
The socket housing board is made from a durable thermoplastic, and the contact array is made of beryllium copper. The contact array is designed to enable easy installation and connection between new or existing boards. The 84535-191LF improves board-to-board electrical connectivity by maintaining signal integrity through its superior contact design. This connector can support traditional and application-specific signal paths. It also offers optional control options for improved power management.
The 84535-191LF is RoHS compliant and meets or exceeds the UL 94V-0 standard for flammability. This connector is also available in multiple terminal pin configurations. Its pin retention design ensures reliable connection even in high-vibration environments.
Conclusion
The 84535-191LF is a great choice for board-to-board application connections, due to its innovative mezzanine technology design that helps minimize component size and design height. Its large lead pitch ensures reliable connection even in high vibration and temperature environments. This connector is RoHS compliant and meets or exceeds the UL 94V-0 standard for flammability. It also offers optional control options for improved power management.
The specific data is subject to PDF, and the above content is for reference
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