85666-127LF

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Backplane connectors are a special class of electrical interconnects that enable communication between two or more devices by transferring various signals, power, and data across an area of an electronic system known as a backplane. The 85666-127LF is a particular type of backplane connector designed to meet rigorous performance requirements in a variety of computer and industrial applications.

The 85666-127LF backplane connector is characterized by its small form factor and unique configuration of contact points, making it suitable for a wide range of application. The contact points of the connector are configured into two banks, each composed of either seven or nine contact pins, arranged in a radial pattern. This arrangement allows for a high level of flexibility in applications, and supports a robust electrical connection.

The 85666-127LF backplane connector is rated for a wide range of electrical influences, including a continuous current of up to 8A and a minimum peak current of 20A. It also supports various temperatures, including operating temperatures of up to 125oC and storage temperatures of up to 150oC. As such, it can be used in multiple markets, such as industrial controls, multimedia, railway, automotive, medical, or consumer electronics.

The working principle of the 85666-127LF backplane connector is based on the principle of electrical interconnects. It uses contact points, located at the separated components, in order to facilitate the connection between them. The contact points are designed to act like an electrical bridge and enable the transfer of electrical signals and power between one or more components. In the case of the 85666-127LF connector, two banks of contact points are used to create robust connections.

The 85666-127LF backplane connector is geared towards applications that require a high level of robustness and performance. Its unique contact point configuration and rated electrical specifications make it suitable for demanding applications across multiple industries. Additionally, its small form factor allows it to be used in space-constrained environments.

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