85757-1103LF

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Backplane Connectors - Specialized applications are used in many industries such as high-end computing, telecommunications, medical, defense and aerospace. One such application is the 85757-1103LF connector. This is a high-speed, multi-pin backplane connector providing High density military grade connection between chassis boards.

Due to the design and construction of the 85757-1103LF, this connector has a wide range of operating characteristics and is designed to meets the most demanding MIL-STD-3216 electrical requirements. This allows for long-term deployments in harsh environments where vibration and mechanical shock could degrade a standard connector’s performance.

The 85757-1103LF provides one-third (1/3) the number of channels per linear inch (1/3rd), as compared to 10/100 Base-T connectors. This makes the 85757-1103LF suitable for use in high density multi-pin applications that require high data transfer and high speed. The 85757-1103LF connector also has the additional benefit of maintaining low insertion loss and with an internal self-grounding system.

The 85757-1103LF’s contact pins are arranged in a unique topology to provide connection to power and signal traces in an efficient manner. This topology ensures minimal signal reflection, crosstalk and EMI/RFI. Due to its high contact density, the 85757-1103LF provides significant benefits to electronic system designers who seek to save valuable space in their design footprint.

The 85757-1103LF connections are also designed with an advanced micro-termination (AMT) technology, that provides a highly reliable electrical and mechanical interfacing between the connector and the inertial board. This technology ensures that the connector maintains its connection even under extreme temperature and vibration fluctuations, meaning the connector is particularly suitable for high-vibration applications such as aerospace and military.

The 85757-1103LF has built-in keying to prevent mismating with other incompatible connectors and is designed to meet a higher ESD performance level than standard connectors. In addition, it has several grounding pins that improve its shielding performance. It is ideal for use in high-frequency applications such as 8.5 GHz RF.

The 85757-1103LF utilizes press-fit, surface mount and flying lead interconnects, providing insulation, strength and longevity in applications. The press-fit option uses resilient pins and sockets designed to eliminate fatigue, decrease the need for wave solder or screw-assembly and the flying lead interconnects provide additional flexibility in configurations and options for prototyping or low-volume applications. The surface mount design option provides the user with the ability to use space-saving components.

The 85757-1103LF is reinforced with robust optimized plastic for strength and durability while also allowing a high degree of flexibility in design placement and orientation. Not only does it reduce the design complexity, it also ensures environmental durability to protect the system in the harshest environmental conditions.

Backplane connectors, like the 85757-1103LF, are designed to address the most demanding military applications. By leveraging military grade connections, exceptional reliability, high frequency capabilities, and superior EMI shielding, connectors like the 85757-1103LF are ideal for the highest performance backplane architectures.

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