85811-101LF Connectors, Interconnects

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Backplane Connectors - Accessories features a variety of products that are important components of computer backplanes. The 85811-101LF is one of these products and it can be used in a variety of applications. This article will discuss the application field and working principle of the 85811-101LF.

Application field

The 85811-101LF is a low profile right-angle connector that can be used in many types of applications. It\'s most commonly used in high-density backplane applications, providing an effective solution to increase board density while still allowing for efficient signal transmission. It\'s also used in a variety of power applications, including power modules and power supplies. Additionally, it can be used in telecom, audio, and video applications.

Working principle

The 85811-101LF utilizes an integral plastic insulating shell which mechanically separates and electrically isolates two signal types. The shielding is applied to the mating leads to prevent crosstalk and other unwanted signals. Its design utilizes reinforced insulation distribution and rigid construction which enables the contact to achieve high contact forces. The 85811-101LF contains two internal, removable, metal shields. The inner shield is designed to suppress crosstalk in the high-frequency range, while the outer shield is used to reduce the total system noise in the low-frequency range. This ensures optimal data transmission while also increasing signal integrity.

The 85811-101LF features a low resistance and miniturized design, allowing it to be used in a variety of tight spaces. It utilizes a unique cupped contact design with an optional faceplate to ensure a low profile, light weight, and high contact force. The 85811-101LF offers a wide range of signal types and layouts, allowing it to be used with a variety of signal types. Its wide variety of shielding options make it ideal for a variety of application areas.

The 85811-101LF is a versatile backplane connector that can be used in a variety of applications. Its low profile design, robust shielding options, and wide range of signal types make it an ideal choice for high-density backplane applications. Its removable shields provide increased signal integrity and its cupped contact design ensures a low profile and high contact force. It is an excellent choice for power delivery, telecom, audio, and video applications.

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