85813-103LF Connectors, Interconnects

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Backplane connectors are connectors that allow electrical continuity between modules or boards in computer systems. The 85813-103LF backplane connector is a high speed/high density surface mount connector that is designed for use in small-form factor applications, such as a Personal Digital Assistant. This backplane connector is designed to provide reliable signal and power transmission, making it suitable for applications where size constraints exist, such as in embedded systems. The 85813-103LF is suitable for PCBs and systems with limited space, and is available in a variety of pitch sizes and configurations.

The 85813-103LF backplane connector is made up of two components, a male and a female connector component. The male component has a total of 81 pins arranged in a 1-by-81 matrix and consists of a spring-loaded, plastic-insulated contact that terminates the signal and power lines to the system boards. The female component has a total of 81 pins that receive the male component’s contact. Each pin has a retention lock that holds the male connector securely in place, ensuring a solid connection.

The 85813-103LF backplane connector offers a range of features designed to improve performance and reliability. It has an extended thermoplastic wall that helps reduce the number of soldered joints, providing higher insulation resistance and improved system grounding; flex-channel assemblies that increase connector stability; an anti-oxidation coating with metal-dust construction that minimizes signal insertion loss and power loss; and a hot-molded thermoplastic construction that provides high insulation resistance and improved resistance to shock and vibration.

The 85813-103LF can deliver power up to 75W and signal up to 4.0 Gbps and provides a simple plug-and-play interface for system board interconnections. Its a double-row, surface-mount configuration that can be mounted horizontally or vertically in flat or vertical receptacles. Its mounting holes allow for a secure fastening to the main board while its design ensures a high level of connectivity. The flexible routing allows for uninterrupted signal transmission, and its high density contact count and its improved EM shielding provide a superior electrical performance.

In conclusion, the 85813-103LF backplane connector is an ideal choice for high-speed, low-profile applications such as small form factor designs. It offers a simple plug-and-play interface for system board interconnections, provides an improved EM shielding and has a high density contact count that provide superior electrical performance. Its enhanced insulation resistance, improved temperature and shock performance and improved grounding enable reliable, long lasting signal and power transmission.

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