89006-1125LF

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Backplane connectors are specialized connectors that are designed to be used when a secure, reliable connection is required. Backplane connectors are found in a variety of applications such as computer systems, communications systems, control systems, access control systems, and automotive systems.

The 89006-1125LF is a type of backplane connector specially designed for high-speed data transfer. It is designed to support up to two differential pairs in either keystone or mezzanine form factor. It is a cost-effective solution for applications such as test and measurement, medical, and telecommunication.

The 89006-1125LF provides efficient interconnection of up to two differential pairs with speeds up to 2 Gbps per pair. It is based on a differential double-density (DDD) architecture, which allows for high-density connections with robust shielding. It also offers good EMI protection and solderability. The connector can be used with either surface-mount or through-hole mounting styles. It is suitable for a variety of applications, including high-speed digital circuits, high-speed data transfer, low-voltage differential signaling (LVDS), and Ethernet.

The 89006-1125LF is designed to work in applications where high-speed and reliable connections are necessary. It\'s double-density architecture allows for maximum data transfer and highest levels of shielding protection. Its ability to accept either surface-mount or through-hole mounting makes it suitable for a wide range of applications. The 89006-1125LF also provides good EMI protection and solderability.

The 89006-1125LF has many practical applications. It can be used in test and measurement applications where high-speed connections and reliable data transfer is required. It is also suitable for medical applications where reliable connections are necessary. Finally, it is also suitable for telecommunication applications where high-speed and reliable connections are necessary.

The working principle behind the 89006-1125LF is based on its double-density architecture. This architecture ensures that two data pairs can be connected in either a keystone or mezzanine form factor. The DDD architecture also ensures that high data transfer rates can be achieved with robust shielding and EMI protection. Finally, the connector also offers good solderability, enabling it to be used with either surface-mount or through-hole mounting.

In conclusion, the 89006-1125LF is a specialized backplane connector designed for high-speed data transfer and reliable connection. It is based on a double-density architecture which allows for high-density connections with robust shielding and EMI protection. Its ability to accept either surface-mount or through-hole mounting styles makes it suitable for a variety of applications, from test and measurement to medical and telecommunication. The 89006-1125LF provides efficient interconnection of up to two differential pairs with speeds up to 2 Gbps per pair, making it a cost-effective solution for any application.

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