89007-1101LF

Backplane connectors, such as 89007-1101LF, provide an interface and interconnect system that allows a large number of printed circuit boards (PCBs) to be connected together to form an interconnected system. Backplane connectors are a critical part of an electrical system’s ability to deliver performance, reliability and scalability. This article provides an overview of 89007-1101LF backplane connector’s application field and working principle.

Application Field

89007-1101LF connector was developed to meet the highest demands of high-density interconnectivity with superior signal integrity. The design was improved to provide low inductance for a reduced footprint. Common application fields of 89007-1101LF connectors are:

• Computer and Peripheral Devices: Typically, computers use 89007-1101LF backplane connectors to connect the motherboard and multiple peripheral devices.
• Networking and Communication Systems: This type of connector is often used to interconnect large networks of networking and communication devices.
• Data Storage Systems: Backbone data storage systems, such as enterprise data storage arrays, use 89007-1101LF connectors to interconnect multiple storage subsystems.

Working Principle

Essentially, a backplane connector consists of two mating members – a header and a receptacle. The 89007-1101LF connector offers a low profile design with 1mm pitch. Both of these connecting components are used to attach to the Printed Circuit Board (PCB). The receptacle is often designed to be a part of the PCB and is then connected to the motherboard using a header.

A key component of this type of connector is the contact. This contact is used to provide electrical connectivity between the two mating components. In the 89007-1101LF connector, the contact is designed with a combination of cantilever and bent design. The cantilever form allows the contact to be securely locked into the receptacle while providing a good contact force to ensure good electrical performance. The bent design results in a lower profile design which helps to reduce the overall size and cost of the connector.

These two elements of the contact design provide numerous benefits including superior signal integrity and reliable connectivity. Additionally, the contact is designed to provide good EMI/RFI shielding and has improved floating contact characteristics for better mating. The connector also provides a wide operating temperature range of -55°C to +105°C.

Conclusion

89007-1101LF backplane connectors are designed for high-density, high-speed, and low-power applications. They feature superior signal integrity and provide low inductance for a reduced footprint. The contact design maximizes electrical performance, shielding, and operates in a wide temperature range.

These backplane connectors are ideal for use in a wide range of applications including computer and peripheral devices, networking and communication systems, and data storage systems. Through its superior design and performance, 89007-1101LF backplane connectors provide reliable connectivity.