89007-110LF Allicdata Electronics
Allicdata Part #:

609-2503-ND

Manufacturer Part#:

89007-110LF

Price: $ 2.64
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN HEADER 60POS VERT PCB PRSFT
More Detail: N/A
DataSheet: 89007-110LF datasheet89007-110LF Datasheet/PDF
Quantity: 584
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: $ 2.40030
10 +: $ 2.30139
25 +: $ 2.10974
50 +: $ 2.01373
100 +: $ 1.91785
250 +: $ 1.67812
500 +: $ 1.63017
1000 +: $ 1.39044
2500 +: $ 1.29455
Stock 584Can Ship Immediately
$ 2.64
Specifications
Series: Metral®
Packaging: Tube 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Header, Male Pins
Connector Style: --
Number of Positions: 60
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 5
Number of Columns: --
Mounting Type: Through Hole
Termination: Press-Fit
Contact Layout, Typical: --
Features: --
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Color: Natural
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Operating Temperature: -55°C ~ 125°C
Voltage Rating: --
Description

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Backplane connectors have important implications when it comes to the transmission of electrical power or data signals. The 89007-110LF connectors are specially designed to meet the demands of high-speed applications. These connectors help achieve reliable, high-speed connections and are used in a variety of applications.

These connectors are used in backplanes in a number of automated applications ranging from data centers to medical equipment to aviation electronics. They are ideal for connecting boards and backplanes because their small size allows them to take up minimal space while offering great performance. Furthermore, the boards and backplanes can be quickly adjusted or exchanged when required as these connectors are ‘split-contact’ type.

The 89007-110LF connectors are two-piece interconnect system which is composed of a receptacle and header. The receptacle, which comes with a single-row connection, is made up of a base housing, contact, alignment insert, and conductor. The receptacle base housing is generally made of UL 94V-0 rated material, and the contact is usually gold-plated for a reliable connection. The alignment insert ensures a positive connection between the two components when plugged in.

The header consists of a mating end that can either be soldered to a printed circuit board (PCB) or fixed to a substrate. The header will secure the devices together to create an electrical connection. The header utilizes a polarization feature which ensures that the devices are connected in the correct way. The headers also feature a latch which locks the devices in place.

The 89007-110LF connectors come with a number of advantages. Firstly, they have excellent thermal performance, since the contacts are designed to dissipate heat quickly and efficiently. Secondly, they also provide high RF shielding and electromagnetic interference (EMI) protection. This makes them ideal for applications where RF signals must be sent from point A to point B. Lastly, they offer superior signal integrity, as they are designed to reduce cross-talk and reduce electrical noise.

The 89007-110LF connectors offer high-speed transmission and are ideal for applications which require a reliable connection with low power loss. They are ideal for device-to-board, device-to-device, and board-to-board connections in applications where stability, performance, and reliability are paramount. Their small size makes them particularly suited to applications requiring small form factors.

In summary, the 89007-110LF connectors are specially designed for high-speed applications, offering reliable, high-speed connections. These two-piece interconnect system consists of a receptacle and header, and is ideally suited to device-to-board, device-to-device, and board-to-board connections. The connectors come with excellent thermal performance, high RF shielding and EMI protection, and superior signal integrity. They provide an ideal solution for applications requiring a small form factor and a reliable connection with low power loss.

The specific data is subject to PDF, and the above content is for reference

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