
Allicdata Part #: | 8903-0150-42-ND |
Manufacturer Part#: |
8903-0150-42 |
Price: | $ 6.51 |
Product Category: | RF/IF and RFID |
Manufacturer: | Laird Technologies EMI |
Short Description: | EGW,MON 4.7X19.1X25.4MM |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
100 +: | $ 5.91620 |
Series: | * |
Part Status: | Active |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
RFI and EMI - Contacts, Fingerstock and Gaskets
Fingerstock contacts, gaskets and shielding products are important components in the control of Radio Frequency Interference (RFI) and ElectroMagnetic Interference (EMI). They provide a physical interface between electrical equipment and a cable, ground wire or metallic enclosure. Thus, they form the connection to a ground source and act as the first line of defense against RFI and EMI leakage.
Efficient contact, fingerstock and gasket performance is critical for numerous industries such as Aerospace, Defense, Medical, Cellular Telephones and Automotive in order to meet RFI and EMI emission and immunity stringent specifications. These include MIL-STD 461 test requirements, FCC Rules & Regulations, European standards, Japanese standards and many more.
The 8903-0150-42 application field and working principle is especially designed for such strict RFI and EMI applications. This Gold plated copper fingerstock contact offers excellent electrical and shielding properties, contact resistance and mechanical stability, optimized for the electrical interconnection of boards, cables, backplanes and enclosures.
The contact fingerstock consists of Gold plating which provides superior electrical and shielding properties and makes the contact suitable for multiple mating cycles. The contact\'s mechanical stability is ensured by a rigid backbone and sharply defined feather-like features for achieving the most reliable electrical and mechanical performance.
The 8903-0150-42 application field and working principle also feature a conductive gasket. The gasket is made from material with extremely good shielding performance, with low, stable contact resistance, high shield attenuation values, even in environments with large temperature variations, and superior tinned plating for facilitating solderability.
Moreover, the conductive gasket can be configured to fit various board profile and other types of application, such as board-to-board, box-to-enclosure, and board-to-wall. Additionally, they are designed to provide excellent EMI shielding to meet the most stringent RFI and EMI emissions performance specifications.
The 8903-0150-42 application field and working principle is an ideal solution for providing an effective shielding interface and radiation control that completely covers the corresponding apertures of the multi-gap interconnection systems. It provides a high degree of leak suppression, low contact resistance and reliable mechanical stability resulting in excellent shielding effect, suitable for a broad range of RFI and EMI applications.
Overall, the 8903-0150-42 application field and working principle is an effective solution for controlling RFI and EMI in a wide range of applications. It is specifically designed to reduce radiation, minimize contact resistance and ensure excellent mechanical stability. This product offers reliable shielding and excellent electrical performance, suitable for multi-gap interconnection systems and ensuring optimal performance in various environments with large temperature variations.
The specific data is subject to PDF, and the above content is for reference
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