
Allicdata Part #: | A115706-ND |
Manufacturer Part#: |
9-1542004-4 |
Price: | $ 8.51 |
Product Category: | Fans, Thermal Management |
Manufacturer: | TE Connectivity AMP Connectors |
Short Description: | 31MM HS ASSY ULTEM CL |
More Detail: | Heat Sink |
DataSheet: | ![]() |
Quantity: | 1000 |
250 +: | $ 7.66108 |
Specifications
Series: | * |
Part Status: | Active |
Description
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Thermal - Heat Sinks are widely used in various applications due to their ability to efficiently dissipate heat generated by components like electronics, computers, and appliances. The 9-1542004-4 is a popular heat sink used for providing thermal management of electronics. It is made of a copper-plated alloy that is designed to provide maximum cooling efficiency in applications where space is limited. The 9-1542004-4 heat sink is designed with a single-step manufacturing process that results in an improved thermal performance. The heat sink has a large absorbent surface area and a low thermal resistance. This design helps to greatly reduce the amounts of heat generated in a device, helping to extend its life. It also helps to reduce the amount of energy that is consumed by the device, resulting in lower overall operating costs.The 9-1542004-4 is a convection-type heat sink that works by dissipating heat through a number of ingeniously designed fins. When air passes through the fins, it absorbs the heat from the device as it circulates around the heat sink and is expelled from the other side. This process expels the heat from the device while creating an area of cooler air in the vicinity. This helps to prevent components from overheating and potentially damaging them. This type of heat sink is fairly easy to install as it only needs two screws for the mounting process. It has a small footprint and takes up minimal space, making it ideal for devices that have limited space. It is also designed to fit most existing components of electronic applications. This makes it a great option for a wide range of applications.The 9-1542004-4 heat sink is a great solution for providing effective thermal management in various applications. It is a lightweight, reliable, and affordable option for dissipating heat in small to medium sized electronics. It has a low thermal risk due to its single-step manufacturing process, making it a safe choice for those looking for a durable and reliable cooling solution.
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