
Allicdata Part #: | 9-1542010-5-ND |
Manufacturer Part#: |
9-1542010-5 |
Price: | $ 7.73 |
Product Category: | Fans, Thermal Management |
Manufacturer: | TE Connectivity AMP Connectors |
Short Description: | 29MM HEATSINK ASSEMBLY |
More Detail: | Heat Sink |
DataSheet: | ![]() |
Quantity: | 1000 |
250 +: | $ 6.95822 |
Specifications
Series: | * |
Part Status: | Active |
Description
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Thermal - Heat Sinks: 9-1542010-5 Application Field and Working Principle
A heat sink is a device, component, or assembly used to absorb heat generated from electronic components and electric circuits. In electronics and electrical engineering, a heat sink is a passive heat exchanger designed to expel or dissipate thermal energy generated by electronic components or assemblies. The device works by allowing thermal energy to flow from the electronic components into the heat sink, and then away from the components and into the environment.The application field of the 9-1542010-5 heat sink is varied, with its use in various electrical and electronic applications. The 9-1542010-5 is a solution for handling high power as well as high-density power components. It is designed to transfer heat away from the power component to the heat sink. The 9-1542010-5 is a thermally managed, conduction-cooled solution for the integration of high power density components and assemblies.The 9-1542010-5 heat sink works on the principle of thermal management. The device is designed to absorb the heat generated from the power component and dissipate it away from the component and into the environment. The heat sink works by transferring the heat absorbed from the electronic component to the fins of the heat sink where it is cooled by circulation of the environment or through the use of a fan. The fins of the 9-1542010-5 are made of copper and are designed to condense the thermal energy out of the air.The 9-1542010-5 is specifically designed to handle the high-power components and assemblies that are commonly used in today\'s electronics. It is designed to significantly reduce temperatures inside of electronic components and assemblies without sacrificing performance or reliability. The heat sink is designed to carry a maximum temperature of up to 150°C (302°F). The 9-1542010-5 is suitable for a wide range of applications, including telecommunications, broadcasting, and radar.The 9-1542010-5 can also be used in a variety of other applications. It is ideal for use in medical devices, video equipment, audio equipment, military electronics, and high power consumer electronics. The heat sink also has the capability to protect equipment from vibration or shock. It is a perfect solution for applications which require a robust, thermal management solution that is easy to install.The 9-1542010-5 is also designed to provide efficient cooling while having an extremely low noise profile. This makes it an ideal choice for applications where reduction in noise is critical, such as audio or video equipment. The heat sink is also designed with a compact design that is lightweight and easy to install.The 9-1542010-5 has earned a reputation for quality, performance, and reliability. It is designed to work in extremely heat concentrated areas, providing superior thermal management. The heat-sink is also designed to provide efficient cooling while maintaining a very low noise profile. It is the perfect choice for power applications involving high-density components and assemblies.The specific data is subject to PDF, and the above content is for reference
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