Allicdata Part #: | 901-10-1-18-2-B-0-ND |
Manufacturer Part#: |
901-10-1-18-2-B-0 |
Price: | $ 2.47 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | HEAT SINK ELLIP FIN 10X10MM CLIP |
More Detail: | Heat Sink |
DataSheet: | 901-10-1-18-2-B-0 Datasheet/PDF |
Quantity: | 1000 |
270 +: | $ 2.22387 |
Series: | * |
Part Status: | Active |
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Thermal - Heat Sinks
A 901-10-1-18-2-B-0 heat sink is a passive heat exchanger designed to regulate and dissipate heat generated from an electronic device’s components. These devices are specifically designed to provide a good thermal conduction path that will allow heat to be effectively taken away from the components in the device and dissipate it so that the components in the device do not overheat. Heat sinks are generally constructed from materials such as aluminum, copper, or even thermally conductive plastics to help draw the heat away from the component.
A 901-10-1-18-2-B-0 heat sink typically have fins that extend out from the side of the heat sink. The fins are designed with an increased surface area on the side that is facing away from the heat sink which helps to dissipate heat away faster and more efficiently. The fins also increase the rate of heat dissipation from the heat sink as the increased surface area will increase the rate at which the heat is transferred from the component to the surrounding environment.
Heat sinks are commonly used in a variety of electronic applications. They are often used in computers and other forms of electronic equipment to keep components cool. Heat sinks can also be used in high power, high temperature applications such as laser diodes and light emitting diodes (LEDs), as well as in automotive, aerospace, and industrial applications. In the automotive field, heat sinks are used extensively to keep vehicle components from overheating and potentially damaging them. In the aerospace field, they are often used to help prevent the excessive heating of vital components to ensure their accurate and consistent performance in mission-critical situations.
The working principle behind a 901-10-1-18-2-B-0 heat sink is the transfer of heat away from the components using thermal conduction. Heat from the components is drawn away from them via the heat sink material and transferred to the fins, where it is then dissipated into the surrounding environment. The more contact points there are between the device’s components and the heat sink the more efficient and effective the heat is dissipated.
Overall, 901-10-1-18-2-B-0 heat sinks are an essential component of any electronic device due to their ability to effectively dissipate heat away from components and prevent them from overheating. Heat sinks are used in a wide range of applications and are essential in order to ensure optimal operation of the device and to protect its components from damage due to excessive temperatures.
The specific data is subject to PDF, and the above content is for reference