902-21-1-28-2-B-0 Allicdata Electronics
Allicdata Part #:

902-21-1-28-2-B-0-ND

Manufacturer Part#:

902-21-1-28-2-B-0

Price: $ 2.55
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEAT SINK ELLIP FIN 21X21MM CLIP
More Detail: Heat Sink
DataSheet: 902-21-1-28-2-B-0 datasheet902-21-1-28-2-B-0 Datasheet/PDF
Quantity: 1000
270 +: $ 2.29068
Stock 1000Can Ship Immediately
$ 2.55
Specifications
Series: *
Part Status: Active
Description

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Thermal - Heat Sinks

Heat sinks are cooling devices composed of thermally conductive metal or other materials designed to dissipate heat away from hot components to cooler surroundings. 902-21-1-28-2-B-0 application fields and working principles of heat sinks are as follows.

902-21-1-28-2-B-0 Application Field:

902-21-1-28-2-B-0 heat sinks are used primarily in the construction of electronic components that require significant cooling. They are commonly used in the production of computers, projectors, and other electronic instruments. Heat sinks are also used in the automotive, medical, and aviation industries because they help reduce the operating temperatures of equipment and extend its lifespan.

902-21-1-28-2-B-0 Working Principle:

The basic principle behind the 902-21-1-28-2-B-0 heat sink is its ability to increase the surface area in contact with the coolant. This is accomplished through the design of the sink which consists of finned or otherwise shaped metal. This design creates surface area for air or some other form of cooling liquid to come into direct contact with the sink. This direct contact creates the heat transfer between the heat source and the cooling liquid, thus cooling the system and allowing the device to perform at its peak efficiency.

The 902-21-1-28-2-B-0 heat sink also uses air cooling to dissipate the heat. Once the heat is dissipated, it is expelled through vents that are located on the sink and then ejected from the system. This process is highly efficient, as it quickly and effectively removes the heat from the system, allowing it to function optimally.

The efficiency of 902-21-1-28-2-B-0 heat sinks is also improved through the addition of a thermal compound. This compound is typically composed of aluminum oxide, graphite, or ceramic. Thermal compounds help to improve the heat transfer between the surface of the heat sink and the component, thus further increasing the efficiency of the cooling system.

902-21-1-28-2-B-0 heat sinks are commonly used to cool a wide range of electronic devices and components. From computers to aircraft, heat sinks are an essential tool in keeping the system running at peak performance. They are able to quickly and efficiently dissipate heat away from the hot components, allowing the system to function optimally and reducing the chance of components failing due to excessive heat.

The specific data is subject to PDF, and the above content is for reference

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