904-27-1-18-2-B-0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The 904-27-1-18-2-B-0 Thermal - Heat Sink is an efficient way to control and disperse heat in electronics components. It is a compact, lightweight solution to addressing thermal demands. This thermal heat sink has an exceptional thermal performance when compared to the more expensive, bulky solutions, and it is designed to be used in a range of applications and with different types of processors and components.

Thermal - Heat Sinks are designed to disperse heat by utilizing fins which transfer the heat from the heat sink, to the surrounding air. The fins are made from highly conductive material that helps dissipate the heat from the surface of the heat sink and transfer it to the surrounding air. With a Thermal - Heat Sink, heat is conducted through the surface of the heat sink to the fins, which are then able to dissipate the heat away from the components. This type of heat sink is well suited for high power processing applications where cooling is critical.

The 904-27-1-18-2-B-0 Thermal - Heat Sink is constructed of high quality aluminum extrusion and nickel plated fins that help to increase the overall thermal efficiency and extend its operating life. The 904-27-1-18-2-B-0 Thermal - Heat Sink features a special design that increases airflow and provides superior thermal protection. This design efficiently dissipates heat quickly and eliminates air pockets from forming. This design also provides superior heat dissipation by creating a larger surface area for heat exchange. The 904-27-1-18-2-B-0 Thermal - Heat Sink also features a number of additional features to ensure maximum performance, including a large base, which reduces pressure and improves contact between the fin and the component, and a high pressure, low profile styling, which enhances overall thermal performance.

The 904-27-1-18-2-B-0 Thermal - Heat Sink can be used in a variety of applications, including computer cooling, LED cooling, medical cooling, and industrial and mil-spec applications. Due to its superior thermal performance and ability to disperse heat quickly, the 904-27-1-18-2-B-0 Thermal - Heat Sink is the preferred choice for many systems that require enhanced cooling capability. The thermal heat sink is also available in a wide variety of sizes and configurations to meet the specific requirements of the application.

The 904-27-1-18-2-B-0 Thermal - Heat Sink is not only designed for maximum efficiency and thermal performance, but it is also highly reliable. It has been tested to provide superior service in many different environments and also has been designed to provide an extended service life. The 904-27-1-18-2-B-0 Thermal - Heat Sink is an excellent choice for a wide variety of thermal management needs, from mobile electronics, cooling systems, and medical equipment, to industrial processes and military applications. This type of thermal heat sink is the optimal solution for providing efficient thermal management and cooling performance for equipment and components.

The specific data is subject to PDF, and the above content is for reference