904-27-1-33-2-B-0 Allicdata Electronics
Allicdata Part #:

904-27-1-33-2-B-0-ND

Manufacturer Part#:

904-27-1-33-2-B-0

Price: $ 3.28
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEAT SINK ELLIP FIN 27X27MM CLIP
More Detail: Heat Sink
DataSheet: 904-27-1-33-2-B-0 datasheet904-27-1-33-2-B-0 Datasheet/PDF
Quantity: 1000
180 +: $ 2.97787
Stock 1000Can Ship Immediately
$ 3.28
Specifications
Series: *
Part Status: Active
Description

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Thermal - Heat Sinks is an important subcategory of electronic cooling solutions. 904-27-1-33-2-B-0 is one such thermal heat sink that has various applications and works with a specific working principle.

The 904-27-1-33-2-B-0 heat sink is made from extruded aluminum which maximizes the heat dissipation. This provides a more efficient cooling solution compared to some alternatives. It is a long lasting product as it is highly resistant to corrosion and deformation.

This heat sink is primarily used in high power semiconductor applications. It is also able to dissipate large volumes of heat more effectively than conventional flat plate solutions. Furthermore, its internal fin design helps to quickly redistribute the additional heat.

Some of the applications for 904-27-1-33-2-B-0 heat sink include circuit boards, LEDs, and electronic control systems. It can also be used in air conditioners, refrigeration systems, and other industrial cooling systems.

The working principle of the 904-27-1-33-2-B-0 heat sink involves a combination of convection and conduction. To effectively dissipate the heat, an airflow must be present inside the heat sink. This airflow is created by the convection process, which depends on the temperature difference between the hot and cold air masses.

The air then passes through the heat sink\'s fins. The fins, in turn, absorb the heat from the air and transfer it to the cool side of the heat sink. This process creates a continuous cycle of heat transfer from the air to the fins and back again. The fins also help to increase the surface area which further enhances heat transfer.

To effectively cool the electronic components, the 904-27-1-33-2-B-0 heat sink should be positioned close to the component. This allows the heat to be quickly dissipated, keeping the component temperature within the optimal range. Additionally, the heat sink should be sized correctly for the components it is intended to cool.

904-27-1-33-2-B-0 is an extremely effective heat sink for high power semiconductor applications. It is capable of dissipating large amounts of heat quickly and efficiently. It is easy to install and maintain, making it a popular choice for many applications.

The specific data is subject to PDF, and the above content is for reference

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