906-31-1-12-2-B-0 Allicdata Electronics
Allicdata Part #:

345-1154-ND

Manufacturer Part#:

906-31-1-12-2-B-0

Price: $ 3.56
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK 31X31X12MM ELLIPTICAL
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: 906-31-1-12-2-B-0 datasheet906-31-1-12-2-B-0 Datasheet/PDF
Quantity: 167
1 +: $ 3.23820
10 +: $ 3.15504
25 +: $ 3.06961
50 +: $ 2.89901
100 +: $ 2.72847
250 +: $ 2.55793
500 +: $ 2.47266
1000 +: $ 2.21687
Stock 167Can Ship Immediately
$ 3.56
Specifications
Series: 906
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip
Shape: Square, Fins
Length: 1.220" (30.99mm)
Width: 1.220" (30.99mm)
Diameter: --
Height Off Base (Height of Fin): 0.457" (11.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.70°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are a key component in electronic cooling and heat management solutions. Heat sinks are used to make sure that temperatures inside an appliance or electronic device stay at a safe level. The 906-31-1-12-2-B-0 Heat Sink is one such example of a top-tier option for maintaining low temperatures in computing by dissipating heat into the environment.

The 906-31-1-12-2-B-0 Heat Sink is designed to provide heat management solutions for computers and other areas of application such as automotive, industrial, and medical. It has an aluminum construction for maximum heat dissipation and an epoxy coating to create a barrier against corrosion and heat. The sink comes in various sizes to suit the needs of the specific application and has a high thermal conductivity, ensuring that it can properly disperse heat in any environment configuration.

The 906-31-1-12-2-B-0 Heat Sink works on the basic principle of thermal conductivity. Thermal conductivity is the measure of an object’s ability to transfer heat from one area to another. The aluminum construction of the heat sink is designed to move heat away from the processor, where it can be dissipated into the environment by fan systems or other cooling measures. The epoxy coating helps ensure that the heat is absorbed efficiently and safely, without taking on any of the electrical conduction that could potentially damage the processor or other components.

The 906-31-1-12-2-B-0 Heat Sink is designed to work with several different types of processor and cooling configurations, including liquid cooling and air cooling. When used with air cooling, the heat generated by the processor is dissipated into the air around the sink, a process that is enhanced by the special design of the fins on the sink. With liquid cooling systems, the heat is then transferred out of the sink and into the coolant that’s flowing through the system. Both systems ensure that the processor keeps itself cool and does not cause any undue damage to the system or components.

The 906-31-1-12-2-B-0 Heat Sink is a great solution for maintaining temperatures inside an appliance or electronic device. Its aluminum construction allows for maximum heat dispersion, while its epoxy coating prevents electrical conduction and corrosion. Its size and configuration make it suitable for even the most advanced processors and cooling solutions. Whether it’s air cooling or liquid cooling systems, the 906-31-1-12-2-B-0 Heat Sink ensures that your system runs at optimal levels and does not suffer from any unnecessary heat damage.

The specific data is subject to PDF, and the above content is for reference

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