| Allicdata Part #: | 345-1152-ND |
| Manufacturer Part#: |
906-31-2-12-2-B-0 |
| Price: | $ 2.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Wakefield-Vette |
| Short Description: | HEATSINK 31X31X12MM PIN |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  906-31-2-12-2-B-0 Datasheet/PDF |
| Quantity: | 1000 |
| 270 +: | $ 2.54838 |
| Series: | 906 |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip |
| Shape: | Square, Pin Fins |
| Length: | 1.220" (30.99mm) |
| Width: | 1.220" (30.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.457" (11.60mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.40°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 12.00°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal-heat sinks, sometimes referred to as a thermal transfer module, are specially designed materials used in the field of electronics to transfer heat energy away from a component to a cooler environment in order to keep the component from overheating. The 906-31-2-12-2-B-0 thermal-heat sink is one type of thermal-heat sink designed to provide a reliable, economic solution to a host of thermal management challenges. The 906-31-2-12-2-B-0 application field and working principle are discussed below.
The 906-31-2-12-2-B-0 thermal-heat sink is a high-strength aluminum fin heat sink, specifically designed to dissipate heat from high-power, high-density electronics and components in a wide variety of applications. The material employed for the 906-31-2-12-2-B-0 thermal-heat sink is a blend of aluminum fins and plates, with specially designed features to maximize heat transfer efficiency. These features include an optimized fin pattern, high-airflow cooling, and a large area of surface-to-air contact.
The 906-31-2-12-2-B-0 is designed for a wide variety of applications, including Circuit boards, Digital signal processors (DSPs), microprocessors, advanced memory modules, and advanced communication systems. In each of these applications, the 906-31-2-12-2-B-0 thermal-heat sink is capable of providing effective heat dissipation, while maintaining a relatively low profile. The low profile design of the heat sink is key to its success, as it enables the heat sink to be installed in even the most densely packed electronic systems.
The 906-31-2-12-2-B-0 thermal-heat sink operates on the principle of convectional heat transfer. Convectional heat transfer is the transfer of heat from a heated surface to a cooler surface via a medium. In the case of the 906-31-2-12-2-B-0, the heated surface is the component generating heat, and the cooler surface is the surrounding air. The medium is a combination of aluminum fins, plates, and channels, which work together to provide an effective thermal solution. The large fin pattern helps promote airflow, while the large area of contact between the heat sink and component increases the efficiency of heat transfer.
The 906-31-2-12-2-B-0 thermal-heat sink is designed to provide a reliable, economic solution to a variety of thermal management challenges. With its optimized fin pattern, high-airflow cooling, and large area of surface-to-air contact, the 906-31-2-12-2-B-0 is capable of effectively dissipating heat from a wide variety of high-power, high-density electronics and components. The 906-31-2-12-2-B-0 is also characterized by its low profile design, which enables it to be installed in the most densely packed electronic systems.
The specific data is subject to PDF, and the above content is for reference