Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

907-33-1-18-2-B-0 application field and working principle

Heat sinks are devices used to dissipate heat from an object, usually an electronic component such as an integrated circuit or a computer processor. They are typically made from metal such as aluminum, copper, or nickel alloys, or composites such as plastic or ceramic. Heat sinks are used to keep heat-generating devices from overheating by dissipating the heat into the surrounding environment.

Heat sinks are typically identified by a thermal resistance rating, which is measured in degrees Celsius per watt (°C/W). The higher the thermal resistance rating, the better the heat sink\'s ability to dissipate heat. This rating is determined by the material used, the size of the heat sink, and how it is mounted to the device.

The 907-33-1-18-2-B-0 heat sink is an extruded aluminum heat sink designed to operate in a wide range of temperatures from -40°C to +90°C. It has a thermal resistance of 0.02°C/W, making it one of the best heat sinks for use with high-power integrated circuits and processors. This thermal resistance rating makes the 907-33-1-18-2-B-0 ideal for cooling applications that require a consistent temperature such as telecommunications, industrial automation, audio, and automotive electronics.

The 907-33-1-18-2-B-0 heat sink is designed with a large fin surface area to maximize heat dissipation. The fins are arranged in an array formation to create a uniformed air flow between them, allowing the air to flow more efficiently and cool the device more effectively. The fins are made from high-performance aluminum to increase the heat dissipation area. The fins are also designed with a curved shape to minimize air turbulence and maximize cooling performance.

The 907-33-1-18-2-B-0 heat sink is designed for use with high power integrated circuits, processors, and power transistors. The heat sink can be mounted directly to the component for optimal cooling performance. The mounting hole pattern is compatible with many standard mounting kits and can be mounted on the PCB using standard screws.

In conclusion, the 907-33-1-18-2-B-0 heat sink is an efficient and high-performance heat sink ideal for a wide variety of applications including telecommunications, industrial automation, audio, and automotive electronics. It offers excellent thermal resistance and a large fin surface area for maximum heat dissipation. The mounting hole pattern is compatible with many standard mounting kits, making this an ideal choice for applications that require a consistent temperature and efficient cooling.

The specific data is subject to PDF, and the above content is for reference