
Allicdata Part #: | 345-1159-ND |
Manufacturer Part#: |
908-35-1-23-2-B-0 |
Price: | $ 4.45 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Wakefield-Vette |
Short Description: | HEATSINK 35X35X23MM ELLIPTICAL |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ![]() |
Quantity: | 224 |
1 +: | $ 4.03830 |
10 +: | $ 3.92868 |
25 +: | $ 3.71020 |
50 +: | $ 3.49196 |
100 +: | $ 3.27379 |
250 +: | $ 3.05553 |
500 +: | $ 2.83727 |
1000 +: | $ 2.78270 |
Series: | 908 |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Clip |
Shape: | Square, Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.892" (22.65mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 2.10°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 8.80°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are an efficient way to keep electronic components and other components cool. The 908-35-1-23-2-B-0 is a high-quality thermal-heat sinks that provide great thermal-heat dissipation capabilities. The thermal-heat sink has a number of features that make it one of the most efficient and reliable solutions to heat dissipation in electronic circuits.
The 908-35-1-23-2-B-0 thermal-heat sinks application field mainly apply to situations where high temperatures are required to prevent the overheating of components. It can also be applied in applications where high thermal cycling is required. The thermal-heat sinks can also be used to manage power dissipation and prevent components from over-heating. The 908-35-1-23-2-B-0 is also resistant to extreme temperatures and materials, including aluminum and copper.
The 908-35-1-23-2-B-0 thermal-heat sinks working principle is an advanced design that integrates a series of features that make it one of the best heat-dissipating solutions. The design includes a number of fin arrays that are arranged in a specific manner for enhanced thermal cooling. The fin arrays are positioned to efficiently transfer the heat to the outer surface of the thermal-heat sink. The fin arrays are designed with increased wicking action to further enhance thermal-heat dissipation capabilities.
Additionally, the 908-35-1-23-2-B-0 thermal-heat sink is equipped with a number of heat-conductive materials that include a thermal-conducting surface or substrate. The materials aid in the dissipation of heat by efficiently transferring the heat away from the hot components. The subsurface layer is also designed with a high-quality thermal-conductivity to facilitate smoother cooling.
The 908-35-1-23-2-B-0 thermal-heat sink is also designed with advanced and reliable thermal insulating materials for effective insulation. The thermal-insulating materials help to reduce heat losses in the system while keeping the surface temperatures low. This feature is especially useful in applications such as communications, consumer electronics, and automotive electronics.
The 908-35-1-23-2-B-0 thermal-heat sink is available in a wide range of shapes and sizes to meet the needs of different applications. The product also has a number of different types of mounting hardware that allow for multiple applications. The product is also easy to install and requires no maintenance for continued efficiency.
Overall, the 908-35-1-23-2-B-0 thermal-heat sink is a reliable and efficient way to keep electronic components and other components cool. The advanced design integrates a series of features that make it one of the most efficient and reliable solutions to heat dissipation in electronic circuits. The thermal-heat sink is available in a wide range of shapes and sizes, making it a great option for many different applications.
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