908-35-2-12-2-B-0 Allicdata Electronics
Allicdata Part #:

345-1153-ND

Manufacturer Part#:

908-35-2-12-2-B-0

Price: $ 3.94
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK 35X35X12MM PIN
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: 908-35-2-12-2-B-0 datasheet908-35-2-12-2-B-0 Datasheet/PDF
Quantity: 367
1 +: $ 3.57840
10 +: $ 3.48201
25 +: $ 3.28835
50 +: $ 3.09494
100 +: $ 2.90153
250 +: $ 2.70809
500 +: $ 2.51466
1000 +: $ 2.46630
Stock 367Can Ship Immediately
$ 3.94
Specifications
Series: 908
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip
Shape: Square, Pin Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.457" (11.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.10°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal – Heat Sinks are an integral part of almost every modern electronic system or circuit; it acts like a bridge to help in the dissipation of heat away from a component or a device. The 908 – 35 – 2 – 12 – 2 – B – 0 is a prime example of this type of heat sink and its basic applications and working principles are outlined in this article.

The 908 – 35 – 2 – 12 – 2 – B – 0 is made of aluminum fins that have been treated with a special coating to resist corrosion and oxidation. It is composed of two parts: the core and the fins which house the pins. The core consists of a heat-conductive base, usually aluminum, to which two sets of aluminum fins are attached to form an airtight chamber.This airtight chamber helps direct the flow of air over the heat-generating components, ensuring maximum air circulation. The fins are spaced in such a way as to maximize surface area and increase the total coefficient of thermal conductivity.

The 908 – 35 – 2 – 12 – 2 – B – 0 can be used in several different applications. One common application, for example, is in computer motherboards, where high levels of heat generation from the Central Processing Unit (CPU) can cause other components to overheat. The 908 – 35 – 2 – 12 – 2 – B – 0 can be installed to direct the heat away from the CPU and other components to keep them from overheating. By doing this, the overall temperature of the system is kept at an optimal level, allowing for improved efficiency and longer life for the individual components.

Another use for the 908 – 35 – 2 – 12 – 2 – B – 0 is in small electronic components or devices such as cell phones or cameras. As these devices are used more frequently, their internal temperatures increase and can damage or decrease the lifespan of the components. Installing a 908 – 35 – 2 – 12 – 2 – B – 0 can help keep the temperature at an optimal level and provide a greater protection for the internal components.

Finally, the 908 – 35 – 2 – 12 – 2 – B – 0 can also be used as part of a larger cooling system. It can be combined with other types of cooling infrastructure, such as fans, pumps, and radiators, to create a total system that is more efficient in its cooling capabilities. This type of setup can be especially beneficial in industrial applications where the amount of heat generated can be very large.

The 908 – 35 – 2 – 12 – 2 – B – 0 is a versatile cooling device that can be used in a variety of applications. It is effective in dissipating heat away from individual components and devices, as well as larger systems. Its combination of an efficient air-flow system and corrosion-resistant aluminum fins ensures a greater lifespan and improved efficiency for any electronic system or device that it is used in.

The specific data is subject to PDF, and the above content is for reference

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