91901-31209LF Allicdata Electronics
Allicdata Part #:

91901-31209LF-ND

Manufacturer Part#:

91901-31209LF

Price: $ 0.72
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN HEADER 9POS 1MM VERT SMD
More Detail: 9 Position Connector Header, Center Strip Contacts...
DataSheet: 91901-31209LF datasheet91901-31209LF Datasheet/PDF
Quantity: 1000
4000 +: $ 0.65610
Stock 1000Can Ship Immediately
$ 0.72
Specifications
Series: Conan™, MezzSelect™
Packaging: Tape & Reel (TR) 
Part Status: Active
Connector Type: Header, Center Strip Contacts
Number of Positions: 9
Pitch: 0.039" (1.00mm)
Number of Rows: 2
Mounting Type: Surface Mount
Features: Solder Retention
Contact Finish: Gold or Gold, GXT™
Contact Finish Thickness: 15.0µin (0.38µm)
Mated Stacking Heights: 4.5mm
Height Above Board: 0.048" (1.22mm)
Description

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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) technology is rapidly becoming the go-to technology for interconnect solutions in many industries. In order to ensure efficient and reliable operation of these systems, it is important to understand their application field and working principle. The 91901-31209LF is a fully compliant board-to-board connector system from Samtec, a leader in interconnect solutions. This article aims to discuss the application fields and working principle of the 91901-31209LF.

Application Fields

The 91901-31209LF is designed for applications happening in high-speed board-to-board configurations. The metallic board-in-board array connector has a low profile, eliminating worries of an application being too bulky for efficient operation. According to Samtec datasheet, the height of the connector is only 4.50 mm maximum above the board.

The 91901-31209LF uses mezzanine design to provide a reliable, through-hole mating connection. This design enables the connector to make multiple mating connections in a single configuration. This saves space and reduces weight, making it an ideal solution in applications such as military, aerospace, and telecommunications.

The 91901-31209LF also boasts superior performance when used in medical equipment. The device has excellent resistance against infection, as well as exceptional electrical performance in medical applications. Its gold plated contacts also provide superior reliability even in harsh environments.

Working Principle:

The 91901-31209LF is a type of board-to-board connector. It types of connectors are commonly found in PC motherboards, backplanes, and mobile phones. Instead of using wires for interconnections, this type of connector uses a contact array to make physical contact with two boards. As the boards are joined together, they create a continuous connection.

The 91901-31209LF is a Grade 8 edge contact connector. It has a high-density contact array, housed in an insulative body. This contact array is held together by an insert-molded cage structure. The contacts are arranged in staggered rows, and feature Samtec’s patented “intimate contact” technology.

The intimate contact technology ensures the boards are firmly connected, and provides reliable electrical connections between the boards. The inserts are designed to accommodate flexible PCBs, and have a very low contact resistance. This contributes to the overall superior performance of this connector in different applications.

The 91901-31209LF connector is not just reliable and efficient, it is also easy to assemble. The connectors come with a keyed guide strip to aid in proper placement of the PCBs and the connector assembly. This additional convenience makes it even more ideal for fast and efficient mounting within an array of PCBs.

Conclusion:

The 91901-31209LF board-to-board connector system is an ideal solution for applications in high-speed board-to-board connections. It is reliable, efficient, and easy to assemble, making it the perfect choice for military, aerospace, telecommunications, and medical projects. Its superior performance and robust design make it a great option for interconnect solutions.

The specific data is subject to PDF, and the above content is for reference

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