93289-140LF Allicdata Electronics
Allicdata Part #:

93289-140LF-ND

Manufacturer Part#:

93289-140LF

Price: $ 3.95
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN HEADER 80POS .050" STR PCB
More Detail: Connector Header Surface Mount 80 position 0.050" ...
DataSheet: 93289-140LF datasheet93289-140LF Datasheet/PDF
Quantity: 1000
1980 +: $ 3.55207
Stock 1000Can Ship Immediately
$ 3.95
Specifications
Series: Rib-Cage™ III
Packaging: Tube 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Number of Positions: 80
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Number of Positions Loaded: All
Style: Board to Board
Shrouding: Shrouded - 4 Wall
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.130" (3.30mm)
Contact Length - Post: --
Overall Contact Length: --
Insulation Height: 0.298" (7.57mm)
Contact Shape: Square
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Material: --
Insulation Material: Thermoplastic, Glass Filled
Features: Board Guide
Operating Temperature: -55°C ~ 130°C
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: 8.26mm
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Applications: --
Description

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Rectangular Connectors - Headers, Male Pins are a type of connectors used to connect two devices, and to make an electrical connection between them. They come in a variety of shapes, sizes, and connection types. The 93289-140LF is one such connector, with a low-profile surface-mount solution for chip-to-chip and board-to-board applications. This article will discuss the application field and working principle of the 93289-140LF.

The 93289-140LF is an ultra-low profile, 1.40mm pitch, SMT header with an open pin-end and a straight lead that allows for board stacking. This makes it ideal for applications with shorter board-to-board and chip-to-chip distances. It provides space savings compared to standard leaded connectors, and is suitable for power and signal applications. It is available in 20, 22 and 24 positions, with plating options of gold, tin, or tin/lead over nickel.

The 93289-140LF can be used in board-to-board applications, such as the connection of a PC-board to a device board or cable assembly. It can also be used in power and signal applications, such as embedded system applications with higher current and voltage requirements. The 93289-140LF is especially suitable for low-power applications requiring the interconnection of two separate boards.

The 93289-140LF connector is designed to allow the contact pins to come into contact with each other. This contact is known as a pin-to-pin connection. This type of connection is used in applications such as board-to-board and chip-to-chip interconnections. The connection is made when the contact pins are inserted into the corresponding mating contacts on the connected device, creating a secure electrical connection.

The 93289-140LF connector is designed to ensure a reliable and secure connection. The contact pins are designed to have a precise tolerance and a low contact resistance, making them suitable for power and signal applications. Additionally, the pins are designed to be low-profile, allowing them to fit in tight-fitting areas or in spaces with limited clearance. The pins also have an anti-contamination feature, which prevents debris or dust from entering the contact points, ensuring the contact is free from oxidation.

The 93289-140LF connector is a robust and reliable solution for chip-to-chip and board-to-board applications. It offers a low-profile and space-saving solution for applications with restricted board size or height requirements. Additionally, its low contact resistance and anti-contamination features ensure a secure and reliable connection. The 93289-140LF is a versatile and reliable solution for embedded system applications.

The specific data is subject to PDF, and the above content is for reference

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