Allicdata Part #: | 93689-105-20LF-ND |
Manufacturer Part#: |
93689-105-20LF |
Price: | $ 2.23 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | HEADER BERGSTIK |
More Detail: | Connector Header Through Hole 20 position 0.100" (... |
DataSheet: | 93689-105-20LF Datasheet/PDF |
Quantity: | 1000 |
600 +: | $ 2.00481 |
Series: | BERGSTIK® |
Packaging: | Bulk |
Part Status: | Active |
Connector Type: | Header, Breakaway |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 20 |
Number of Rows: | 1 |
Row Spacing - Mating: | -- |
Number of Positions Loaded: | All |
Style: | Board to Board |
Shrouding: | Unshrouded |
Mounting Type: | Through Hole |
Termination: | Press-Fit, Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.327" (8.30mm) |
Contact Length - Post: | 0.177" (4.50mm) |
Overall Contact Length: | 0.608" (15.44mm) |
Insulation Height: | 0.100" (2.54mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold, GXT™ |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Post: | Tin |
Contact Material: | Phosphor Bronze |
Insulation Material: | Thermoplastic |
Features: | -- |
Operating Temperature: | -- |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Black |
Current Rating: | -- |
Voltage Rating: | -- |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | 39.4µin (1.00µm) |
Applications: | -- |
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Rectangular Connectors - Headers and Male Pins are essential components in modern electronics. A 93689-105-20LF is a particular type of rectangular connector commonly used in a range of applications. In this article, we will discuss the 93689-105-20LF, including its application field and working principle.
Application Field
The 93689-105-20LF is mainly used in applications where a large number of signals must be transmitted at high speeds. One of the most common application fields is high-speed data acquisition and communication, as well as mobile device charging. This type of connector is also widely used in computer motherboards, electric vehicles, transceivers, power supplies, and DC motors.
Working Principle
The 93689-105-20LF is a pin header that is designed for high-speed data transfer and signal integrity. It is marked by a long, flat base that is outfitted on one end with a 2mm lead spacing. The lead spacing in consists of five rows of 2mm pins and two rows of 5mm pins, arranged evenly in a grid-like pattern. The headers are soldered into place on the corresponding circuit board.
The 93689-105-20LF is primarily used in a point-to-point connection. This means that the cable connecting the two components with this type of connector is capable of carrying a large amount of data over a long distance without compromising its integrity. This type of connection is also highly reliable and offers a high level of signal integrity.
In order to ensure that the signal is properly transferred from one end to the other, the 93689-105-20LF is equipped with a number of features. These include a rugged, corrosion-resistant construction; a reliable, precision-machined contact surface; and an amply sized, polarity-protected mating area for secure mating of the pins. Moreover, the long-term mechanical integrity of the connector is further enhanced with a locking mechanism.
The 93689-105-20LF also offers a number of features that make it especially suitable for a wide range of applications. The transistor-level mismatched connections are managed through precise length adjustment, allowing for improved signal integrity. The small form factor allows for a high degree of integration and a tight fit into the PCB. The header also features an electroless nickel plating that increases the connector’s durability in demanding applications.
In conclusion, the 93689-105-20LF is a reliable, rugged, and versatile connector that is suitable for a range of different application fields. Its long, flat base provides a reliable point-to-point connection that facilitates the transfer of high-speed data without compromising signal integrity. Moreover, it features a range of features that further enhance its suitability, such as a locking mechanism and electroless nickel plating.
The specific data is subject to PDF, and the above content is for reference
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