94611-424HLF Allicdata Electronics
Allicdata Part #:

94611-424HLF-ND

Manufacturer Part#:

94611-424HLF

Price: $ 0.53
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: HEADER BERGSTIK
More Detail: Connector Header Through Hole 24 position 0.100" (...
DataSheet: 94611-424HLF datasheet94611-424HLF Datasheet/PDF
Quantity: 1000
1200 +: $ 0.47213
Stock 1000Can Ship Immediately
$ 0.53
Specifications
Operating Temperature: --
Insulation Height: 0.100" (2.54mm)
Contact Shape: Square
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: --
Features: --
Overall Contact Length: 0.320" (8.13mm)
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Number of Positions Loaded: All
Packaging: Bulk 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 24
Number of Rows: 1
Row Spacing - Mating: --
Series: BERGSTIK® II
Style: Board to Board
Shrouding: Unshrouded
Mounting Type: Through Hole
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.125" (3.18mm)
Contact Length - Post: 0.095" (2.41mm)
Description

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The 94611-424HLF rectangular connector, or header, is a two-position, dual row, press-fit device that is commonly used for providing a solder-free connection on printed circuit boards. It is particularly suited for use in high power, wire-to-board connections and is used in a variety of electronic devices, including industrial, consumer, medical and aerospace applications.

The 94611-424HLF was designed to be a cost-effective, space-saving solution for tight, high reliability, low voltage applications such as lighting assembly, automotive relay applications and power distribution equipment. It offers a footprint of 0.323 x 0.234 inches and an insulation resistance of greater than 200 megaohms.

The 94611-424HLF is a two-position, dual row press-fit device that consists of an insulated sleeve and a header that is mated to a printed circuit board. The header is designed to accept two insulated pins on one side, and a conductive pin on the other side. The insulated sleeve helps to protect the two pins from contact with other components. The conductive pin bridges the two pins, providing an electrical connection between the pins.

The header and the pins of the 94611-424HLF are designed to be easily installed in a printed circuit board. The headers are secured to the board by press-fitting the pins into the hole patterns. The pins then become firmly attached to the board, providing a secure and reliable connection. The header is also securely held in place by a solder-resistant insulation material.

The 94611-424HLF features a variety of advantages, such as low cost, reliability, high resistance, and low contact resistance. It offers superior performance compared to other connectors in terms of vibration, shock, and current load. It is also an excellent option for applications in hostile environments. The header is designed to meet strict UL safety standards, providing peace of mind to customers.

In terms of performance, the 94611-424HLF offers a high temperature range of -40°C to 125°C. It can also handle high amperage of up to 26 Amps. Additionally, it features an excellent insulation resistance of greater than 200 Megaohms.

The 94611-424HLF is an ideal choice for providing reliable, cost-effective wire-to-board connections in a variety of applications. It has been designed to meet the needs of high power, wire-to-board connections and offers superior performance compared to other connectors. With its features, such as low cost, high resistance, low contact resistance, and high-temperature range, the 94611-424HLF is perfect for a variety of applications, such as automotive relay assemblies, and power distribution equipment.

The specific data is subject to PDF, and the above content is for reference

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