Allicdata Part #: | 95242-409LF-ND |
Manufacturer Part#: |
95242-409LF |
Price: | $ 1.55 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | CONN RCPT 18POS .100" DBL SMD |
More Detail: | 18 Position Receptacle, Bottom or Top Entry Connec... |
DataSheet: | 95242-409LF Datasheet/PDF |
Quantity: | 1000 |
400 +: | $ 1.41319 |
Insulation Color: | Black |
Contact Finish Thickness - Post: | 78.7µin (2.00µm) |
Contact Material: | Phosphor Bronze |
Contact Shape: | Square |
Insulation Material: | Thermoplastic, Glass Filled |
Applications: | Automotive, General Purpose, Industrial, Telecommunications |
Voltage Rating: | -- |
Current Rating: | -- |
Features: | -- |
Ingress Protection: | -- |
Mated Stacking Heights: | -- |
Contact Finish - Post: | Tin |
Material Flammability Rating: | UL94 V-0 |
Operating Temperature: | -- |
Contact Length - Post: | -- |
Insulation Height: | 0.275" (6.99mm) |
Series: | Dubox™ |
Contact Finish Thickness - Mating: | 78.7µin (2.00µm) |
Contact Finish - Mating: | Tin |
Fastening Type: | Push-Pull |
Termination: | Solder |
Mounting Type: | Surface Mount |
Row Spacing - Mating: | 0.100" (2.54mm) |
Number of Rows: | 2 |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions Loaded: | All |
Number of Positions: | 18 |
Style: | Board to Board |
Contact Type: | Female Socket |
Connector Type: | Receptacle, Bottom or Top Entry |
Part Status: | Active |
Packaging: | Tube |
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Rectangular connectors are electrical connectors used to bring together and connect multiple circuit elements like wires and boards. They come in various sizes, shapes, and applications. Among them are headers, receptacles, and female sockets. Headers, receptacles, and female socket connectors are some of the most common types of rectangular connectors and provide a variety of ways for interconnecting various electrical components.
One of these types of rectangular connectors, the 95242-409LF, is a four-circuit, surface mount socket mating device that is used to connect multiple circuit elements to another device. The 95242-409LF is designed in accordance with JEDEC Standard MO-154 which is applicable to high-density, surface mount applications and is intended for use with the 0.050″ pitch, JEDEC compliant SOIC family of packages. The low-profile design of the 95242-409LF, with its feature-rich design, makes it suitable for many high-density, mixed-signal application fields.
The 95242-409LF socket connector is composed of an insulation body, a four-circuit, surface mount socket contacts, and a top cover. It is made of UL94V-0 rated polyester material and is suitable for soldering in high-temperature reflow process. The housing is 2.20 mm above the PCB and has a single-row design with four connections. The contacts are made of Phosphor bronze with gold-plated contacts.
The 95242-409LF is designed for use in high-density, mixed-signal applications. It is ideal for applications such as security systems, medical devices, and telecommunications equipment. It is also used in automotive electronics and high-speed digital applications. The 95242-409LF connector’s main advantage is its small size and low-profile design. It is designed to provide reliable and robust connections in high-density applications. Due to its low-profile design, the 95242-409LF connector provides greater flexibility and reliability in an increasingly smaller package.
The working principle of the 95242-409LF is based on a basic four-circuit connection. It utilizes four pins, which provide electrical contact, to connect multiple circuit elements with another device. The four pins are arranged in a single row and each one is soldered individually to its respective contact pads.
The 95242-409LF connector is designed to provide excellent connection reliability and enable efficient packaging of components in high-density applications. It has a wide range of applications and provides reliable and robust connections with minimal effort. The 95242-409LF connector is designed to provide reliable and robust connections in high-density applications, allowing for more efficient packaging of components.
The specific data is subject to PDF, and the above content is for reference
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