Allicdata Part #: | HMU25H-ND |
Manufacturer Part#: |
A-DSF 25LPIII/Z-UNC |
Price: | $ 1.81 |
Product Category: | Connectors, Interconnects |
Manufacturer: | ASSMANN WSW Components |
Short Description: | CONN D-SUB PLUG 25POS STR IDC |
More Detail: | 25 Position D-Sub Plug, Male Pins Connector |
DataSheet: | A-DSF 25LPIII/Z-UNC Datasheet/PDF |
Quantity: | 1173 |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
1 +: | $ 1.64430 |
10 +: | $ 1.49121 |
25 +: | $ 1.39986 |
50 +: | $ 1.33888 |
100 +: | $ 1.27802 |
250 +: | $ 1.15630 |
500 +: | $ 1.06502 |
1000 +: | $ 0.91287 |
2500 +: | $ 0.85201 |
Features: | Feed Through, Grounding Indents, Strain Relief |
Backset Spacing: | -- |
Contact Material: | Copper Alloy |
Wire Gauge: | 26-28 AWG |
Housing Material: | Polybutylene Terephthalate (PBT), Glass Filled |
Contact Form: | -- |
Color: | Black |
Voltage Rating: | 250V |
Operating Temperature: | -55°C ~ 105°C |
Current Rating: | 3A |
Material Flammability Rating: | UL94 V-0 |
Ingress Protection: | -- |
Contact Finish Thickness: | Flash |
Contact Finish: | Gold |
Shell Material, Finish: | Steel, Tin Plated |
Series: | -- |
Termination: | IDC, Ribbon Cable |
Flange Feature: | Housing/Shell (4-40) |
Mounting Type: | Free Hanging (In-Line) |
Contact Type: | Signal |
Shell Size, Connector Layout: | 3 (DB, B) |
Number of Rows: | 2 |
Number of Positions: | 25 |
Connector Type: | Plug, Male Pins |
Connector Style: | D-Sub |
Moisture Sensitivity Level (MSL): | -- |
Part Status: | Active |
Lead Free Status / RoHS Status: | -- |
Packaging: | Tray |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
D-Sub connectors are essential components used in the electrical and electronics industries. The A-DSF 25LPIII/Z-UNC is one of the most common d-sub connectors due to its wide range of applications and its high quality. In this article, we will be discussing the application field and working principle of the A-DSF 25LPIII/Z-UNC.
The A-DSF 25LPIII/Z-UNC is a high-grade, sealed connector system designed for commercial and industrial applications. It is constructed with durable die-cast metal housing, nickel plated contacts, and fiber optics. The A-DSF 25LPIII/Z-UNC is available in a variety of sizes and configurations, with a wide range of standard and custom pins. It can be used in a variety of applications including medical electronics, industrial control, telecommunications, and automotive electronics.
The A-DSF 25LPIII/Z-UNC has a comprehensive range of working principles. It is designed to provide a reliable, secure connection between two or more points. The contact pins are placed in a correctly designed cavity, providing an effective electrical connection between devices. The pins are movable, allowing the connections to be easily adjusted or changed when needed. The pins are designed to engage and disengage quickly, making the connections easy to use and maintain. The A-DSF 25LPIII/Z-UNC also provides a tight seal and protection from dust and dirt, making it suitable for a wide range of environments.
The A-DSF 25LPIII/Z-UNC is a versatile d-sub connector system that is suitable for a wide range of applications. It is used in a variety of medical electronics applications such as monitoring devices, medical imaging equipment, and patient data acquisition. It is also frequently used in industrial control systems and telecommunications. Its versatility and ability to withstand high temperatures make it ideal for automotive electronics. It is also increasingly being used in consumer electronics applications, such as digital cameras, MP3 players, and game consoles.
The A-DSF 25LPIII/Z-UNC is a reliable d-sub connector system with a wide range of applications. It is designed to provide a secure, reliable connection between two or more points. Its die-cast metal housing and nickel plated contacts make it durable and reliable. And the wide variety of sizes and configurations make it suitable for a variety of applications.
The specific data is subject to PDF, and the above content is for reference
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