| Allicdata Part #: | ATS-01A-05-C1-R0-ND |
| Manufacturer Part#: |
ATS-01A-05-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01A-05-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronics is crucial for device longevity. Heat generated by the components must be effectively managed so as not to overheat and burn out the parts, or cause malfunctions. The ATS-01A-05-C1-R0 is a thermal management cooling solution for this purpose.
The ATS-01A-05-C1-R0 is a heat sink solution specifically designed to address the heat dissipation needs of consumer electronic products. It is a one-piece aluminum heat sink that features a pressure plate with fins to ensure efficient heat transfer. It also includes a bonded heat spreader to guarantee uniform heat dissipation across the entire cooling area. Furthermore, the ATS-01A-05-C1-R0 can be used for both active and passive cooling, making it highly efficient and reliable.
The primary application field for the ATS-01A-05-C1-R0 is consumer electronics, such as mobile phones, tablets, TVs, and computers. It is suitable for devices that generate high amounts of heat, such as high-end graphics cards or processors. Additionally, it can be used in other industries where thermal management is important, such as aviation, automotive, and military.
The ATS-01A-05-C1-R0 works by utilizing the principles of thermodynamics. It uses the exchange of heat between two materials in order to transfer the heat generated by the components to the atmosphere. Heat can be transferred to the atmosphere either through radiation or conduction. In either case, the heat sink has to be able to conduct the heat efficiently away from the components, while dissipating it to the atmosphere.
The ATS-01A-05-C1-R0 is designed to ensure efficient heat dissipation with its advanced fin design. The pressure plate is connected to the fins via two separate walls of aluminum. The two walls create an atmosphere where hot air is exchanged between the two surfaces. This exchange is what causes the heat to be conducted away from the components to the plates and then to the fins. The fins then dissipate this heat to the atmosphere.
The ATS-01A-05-C1-R0 is a highly effective tool for thermal management. It features an advanced design that allows for efficient and reliable heat transfer and dissipation. Its application field is broad and can be applied to a variety of industries, as well as consumer electronics. With its efficient cooling capabilities, the ATS-01A-05-C1-R0 is an excellent choice for thermal management solutions.
The specific data is subject to PDF, and the above content is for reference