| Allicdata Part #: | ATS2647-ND |
| Manufacturer Part#: |
ATS-01A-07-C2-R0 |
| Price: | $ 3.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01A-07-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.52800 |
| 10 +: | $ 3.43539 |
| 25 +: | $ 3.24450 |
| 50 +: | $ 3.05361 |
| 100 +: | $ 2.86278 |
| 250 +: | $ 2.67193 |
| 500 +: | $ 2.48108 |
| 1000 +: | $ 2.43337 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.00°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become an increasingly important part of modern industrial engineering, with heat sinks suddenly becoming an indispensible element in many applications. One such heat sink is the ATS-01A-07-C2-R0, an advanced piece of thermal technology that is designed to effectively dissipate large amounts of heat.
The ATS-01A-07-C2-R0 is a high performance aluminum extruded heat sink with excellent thermal properties. It has been designed to effectivelyremove and dissipate the thermal energy generated by embedded processors, FPGA\'s, and ASICs in industrial electronic systems. It is constructed from 6063 T6 aluminum, which has been treated togive it superiorin thermal conductivity,apart from excellent heat dissipation that exceeds the required industry standards.
The ATS-01A-07-C2-R0 utilizes advanced anode technology to increase its thermal performance. This anode technology increases the surface area of the heat sink so that more heat can be removed and dissipated at a more efficient rate. This makes it much more effective than many other standard pieces of thermal management technology.
The ATS-01A-07-C2-R0 heat sink also hasa number of special features designed to improve its thermal performance. This includes a molded plasticclipping device, which allows the heat sink to be securely attached totheapplication board. This ensures that the heat sink is firmly held in place, even when subject to vibration or movement. It also comes complete with two thermal resistors to ensure the optimal operation ofthe application board.
The ATS-01A-07-C2-R0 is the ideal solution for industrial applications that require effective thermal management. It is robust, reliable and designed to provide superior thermal efficiency. In addition, this heat sink is simple and easy to install on the application board and comes with a comprehensive warranty, providing peace of mind for the user.
The working principle of the ATS-01A-07-C2-R0heat sink is based on the laws of thermodynamics. Heat is transferred from the application board to the heat sinkvia conduction. The heat sink then dissipates the heat via convection, providing an effective cooling solution for the whole system.
The ATS-01A-07-C2-R0 heat sink provides a highly effective and reliable solution for industrial applications that generate high amounts of heat released. It is designed to ensure that the applications can operate safely and effectively,even in the most challenging of conditions. As such, it is the ideal choice for any industrial operation which requires reliable thermal management.
The ATS-01A-07-C2-R0heat sink is ideal for various applications, such as embedded processor-driven systems, FPGA\'s, and ASICs,automotive and medical systems, and even in harsh environments such as military, aerospace, and industrial applications. With its superior heat dissipation capabilities,this heat sink ensures optimal performance on a wide range of industrial applications.
The specific data is subject to PDF, and the above content is for reference