| Allicdata Part #: | ATS2650-ND |
| Manufacturer Part#: |
ATS-01A-10-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01A-10-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.89°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are devices used to safely dissipate the heat generated from an electronic product. The ATS-01A-10-C2-R0 is a heat sink designed for applications requiring high temperature and power dissipation. It is specifically designed to reduce the temperature of electronic components in a variety of applications where cooling is required.
The ATS-01A-10-C2-R0 is a closed system that features a customized fan to cool the components inside. It uses a thermal-conducting metal sheet, made up of aluminum that absorbs heat from the components and transfers it to the fins where it can dissipate into the surrounding air. The ATS-01A-10-C2-R0 also has an air-flow guide that helps ensure the air flow is directed in the right areas, achieving maximum cooling efficiency. The materials used to construct the ATS-01A-10-C2-R0 are specifically chosen to provide optimal thermalperformance and cool air up to 25°C below ambient temperature.
The ATS-01A-10-C2-R0’s working principle is based on the concept of dissipating heat away from the source. Heat is transferred from the source to the heat sink where it is then dissipated into the air. The ATS-01A-10-C2-R0 features a variety of innovative technologies that make this process more efficient. One such technology is the use of thermal-conductive grease to ensure maximum contact between the component and the heat sink, allowing for better heat transfer. Additionally, the ATS-01A-10-C2-R0 utilizes a fan to provide a steady stream of air to help reduce the temperature of the heat sink.
The ATS-01A-10-C2-R0 is suitable for applications involving high temperatures and power dissipation. It can be used in a variety of electronic components such as processors, GPUs, CPUs, power regulators, and voltage regulators. With its ability to cool components up to 25°C below ambient temperature as well as its innovative features, the ATS-01A-10-C2-R0 is an ideal heat sink for applications requiring high performance and high temperatures.
In conclusion, the ATS-01A-10-C2-R0 is a unique heat sink that is designed for applications requiring high temperatures and power dissipation. It utilizes specialized metal sheets to transfer heat away from the components, as well as air-flow guides to ensure that the air is directed to the desired areas. The ATS-01A-10-C2-R0 also features an innovative fan that keeps the heat sink cool. With its ability to reduce temperatures up to 25°C below ambient temperature, the ATS-01A-10-C2-R0 is ideal for a variety of applications requiring high performance and high temperature. Additionally, its design ensures that the components remain safe from thermal damage.
The specific data is subject to PDF, and the above content is for reference