| Allicdata Part #: | ATS-01A-11-C1-R0-ND |
| Manufacturer Part#: |
ATS-01A-11-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01A-11-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.06684 |
| 30 +: | $ 2.98431 |
| 50 +: | $ 2.81849 |
| 100 +: | $ 2.65268 |
| 250 +: | $ 2.48686 |
| 500 +: | $ 2.40397 |
| 1000 +: | $ 2.15528 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management systems have long been used to dissipate heat from electrical and electronic components. Thermal heat sinks are an important part of these systems, allowing for improved efficiency and reliability of the electrical and electronic components. The ATS-01A-11-C1-R0 Thermal - Heat Sink is a device developed to address the challenges of thermal management in modern electronics.
The ATS-01A-11-C1-R0 uses a variety of features and design principles to optimize the thermal management process. It features a high-efficiency, low-temperature aluminum heat sink base with extended fin height for increased heatsink capacity. Additionally, its thermally conductive copper core helps keep the core temperature at a minimum. Its unique design also includes an integrated cooling fan that can be activated in order to further cool down the core temperature. This ensures the stability of the system’s components and reduces the chances of overheating.
The ATS-01A-11-C1-R0 is designed to be used in a variety of different applications. It can be used to cool down CPUs, GPUs, and other applications that require optimum thermal management. Additionally, it can be implemented as a system fan to ensure proper air flow and cooling. It can be used in both home and business applications, and is capable of cooling high-power electronics such as gaming consoles and high-performance servers.
The ATS-01A-11-C1-R0 works by dissipating heat directly from the source component and its surroundings. The heat sink absorbs the heat from the component and transfers it across the surface area of the sink’s fins. As the fins heat up, the air around them is drawn in, creating a cooling effect. This air flow increases the efficiency of the heat sink as it is able to take the heat away from the component and dissipate it at a greater rate. The fan then draws the hot air away from the component and into the surrounding environment.
The ATS-01A-11-C1-R0 is an efficient and reliable thermal management system that is suitable for a variety of applications. It is designed to cool a wide range of components and ensure maximum efficiency and stability. Its aluminum heat sink base and copper core provide superior cooling capabilities, while its integrated cooling fan helps further dissipate the heat. This thermal solution is perfect for environments where efficient heat dissipation is necessary. By taking advantage of its features, users can enjoy a reliable and efficient thermal management system that will protect their valuable components and prolong their lifespan.
The specific data is subject to PDF, and the above content is for reference