ATS-01A-117-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal-Heat Sinks A heat sink is a device that is designed to absorb, disperse, and dissipate the heat that is generated during the electronic operation of any application field. Heat sinks are commonly used in electronics such as computers and other high power devices. The ATS-01A-117-C1-R0 application field is no exception.This heat sink is specifically designed for high temperature applications. It has a large platform size and is capable of dissipating up to 1000 Watts of heat while operating at an ambient temperature up to 230°C. The ATS-01A-117-C1-R0 is suitable for applications requiring a high level of thermal management when exposed to high temperatures. It is constructed with die-cast aluminum frame, extruded fins, and thin pin fin technology.The working principle of the ATS-01A-117-C1-R0 is fairly simple. The heat from the electronic components of the application is first dissipated in the fins of the heat sink. This conducts the heat to the air around it, and thus regulating its temperature. The fins of the heat sink are designed to be narrow, resulting in a higher surface area for increased convective heat transfer. The thin pin fin technology further enhances the heat dissipation of the heat sink by providing extra cooling air jets to keep the core temperature of the component in check.The ATS-01A-117-C1-R0 also features unique features such as water cooling capabilities, axial and radial fan mounts, as well as externally mounted fan guards for increased protection. The unit is also highly efficient and low cost compared to similar variants. It has a thermal resistance of 0.25K/W and can dissipate up to 1KW of heat while operating at an ambient temperature up to 230°C. The ATS-01A-117-C1-R0 is suitable for a wide variety of applications in extreme temperatures. These may include power supplies, medical devices and other mobile applications requiring massive power output in extreme environments. With its excellent thermal conductivity and heat dissipation properties, the heat sink is an ideal choice for applications where thermal management is required in high temperature conditions.

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